Datasheet ADPA7006CHIP (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 18 GHz to 44 GHz, GaAs, pHEMT, MMIC, 1/2 W Power Amplifier |
| Páginas / Página | 24 / 5 — Data Sheet. ADPA7006CHIP. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL … |
| Formato / tamaño de archivo | PDF / 465 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADPA7006CHIP. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter Rating. Table 6. Thermal Resistance
Línea de modelo para esta hoja de datos
Versión de texto del documento
Data Sheet ADPA7006CHIP ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to system design and Drain Bias Voltage (VDDxx) 6.0 V operating environment. Careful attention to the printed circuit Gate Bias Voltage (VGG1) −1.5 V to 0 V board (PCB) thermal design is required. θJC is the channel to Radio Frequency (RF) Input Power (RFIN) 20 dBm case thermal resistance, channel to bottom of die using die Continuous Power Dissipation (PDISS), 8.3 W attach epoxy. T = 85°C (Derate 92.6 mW/°C Above 85°C)
Table 6. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJC Unit
Operating Temperature Range −55°C to +85°C C-14-7 10.8 °C/W Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1B Passed, 750 V
ESD CAUTION
Reliability Information Junction Temperature to Maintain 175°C 1,000,000 Hour Mean Time to Failure (MTTF) Nominal Junction Temperature (T = 85°C, 128.2°C VDD = 5 V, IDQ = 800 mA) Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 28 GHz FREQUENCY RANGE 28 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING THE ADPA7006CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR THE ADPA7006CHIP VGGx AMR (ABSOLUTE MAXIMUM RATING) REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to system design and Drain Bias Voltage (VDDxx) 6.0 V operating environment. Careful attention to the printed circuit Gate Bias Voltage (VGG1) −1.5 V to 0 V board (PCB) thermal design is required. θJC is the channel to Radio Frequency (RF) Input Power (RFIN) 20 dBm case thermal resistance, channel to bottom of die using die Continuous Power Dissipation (PDISS), 8.3 W attach epoxy. T = 85°C (Derate 92.6 mW/°C Above 85°C)
Table 6. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJC Unit
Operating Temperature Range −55°C to +85°C C-14-7 10.8 °C/W Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1B Passed, 750 V
ESD CAUTION
Reliability Information Junction Temperature to Maintain 175°C 1,000,000 Hour Mean Time to Failure (MTTF) Nominal Junction Temperature (T = 85°C, 128.2°C VDD = 5 V, IDQ = 800 mA) Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 28 GHz FREQUENCY RANGE 28 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING THE ADPA7006CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR THE ADPA7006CHIP VGGx AMR (ABSOLUTE MAXIMUM RATING) REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE