Datasheet ADPA7006CHIP (Analog Devices)
Fabricante | Analog Devices |
Descripción | 18 GHz to 44 GHz, GaAs, pHEMT, MMIC, 1/2 W Power Amplifier |
Páginas / Página | 24 / 1 — 18 GHz to 44 GHz, GaAs, pHEMT, MMIC,. 1/2 W Power Amplifier. Data Sheet. … |
Formato / tamaño de archivo | PDF / 465 Kb |
Idioma del documento | Inglés |
18 GHz to 44 GHz, GaAs, pHEMT, MMIC,. 1/2 W Power Amplifier. Data Sheet. ADPA7006CHIP. FEATURES. FUNCTIONAL BLOCK DIAGRAM
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18 GHz to 44 GHz, GaAs, pHEMT, MMIC, 1/2 W Power Amplifier Data Sheet ADPA7006CHIP FEATURES FUNCTIONAL BLOCK DIAGRAM Output P1dB: 29 dBm P V V V V SAT: 29.5 dBm GGB V DD1B DD2B DD3B DD4B VREF Gain: 23.5 dB Output IP3: 38 dBm Supply voltage: 5 V at 800 mA Integrated power detector RFIN RFOUT 50 Ω matched input/output Die size: 2.750 mm × 1.805 mm × 0.102 mm APPLICATIONS Military and space V V V V GGA DD1A DD2A DD3A VDD4A VDET
01 0 6-
Test instrumentation
18 20
Communications
Figure 1.
GENERAL DESCRIPTION
The ADPA7006CHIP is a gallium arsenide (GaAs), intercept of 38 dBm. The ADPA7006CHIP requires 800 mA pseudomorphic high electron mobility transistor (pHEMT), from a 5 V supply on the supply voltage (VDD), and features monolithic microwave integrated circuit (MMIC), distributed inputs and outputs that are internally matched to 50 Ω, facilitating power amplifier that operates from 18 GHz to 44 GHz. The integration in multichip modules (MCMs). All data is taken amplifier provides 23.5 dB of small signal gain, 29 dBm output with the chip connected via two 0.025 mm wire bonds that are power for 1 dB compression, and a typical output third-order less than 0.31 mm long.
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Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 28 GHz FREQUENCY RANGE 28 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING THE ADPA7006CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR THE ADPA7006CHIP VGGx AMR (ABSOLUTE MAXIMUM RATING) REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE