Datasheet TDA6107AJF (Philips) - 5

FabricantePhilips
DescripciónTriple Video Output Amplifier
Páginas / Página16 / 5 — Philips Semiconductors. TDA6107AJF. Triple video output amplifier. …
Formato / tamaño de archivoPDF / 97 Kb
Idioma del documentoInglés

Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Thermal characteristics. Table 4:. Symbol. Parameter. Conditions

Philips Semiconductors TDA6107AJF Triple video output amplifier Thermal characteristics Table 4: Symbol Parameter Conditions

Línea de modelo para esta hoja de datos

Versión de texto del documento

link to page 5
Philips Semiconductors TDA6107AJF Triple video output amplifier 8. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient in free air 56 K/W Rth(j-fin) thermal resistance from junction to fin [1] 11 K/W [1] An external heatsink is necessary; see Application Note AN10227-01. mbh989 8 Ptot (W) (1) 6 4 (2) 2 0 −40 0 40 80 120 160 Tamb (°C) (1) Infinite heatsink. (2) No heatsink.
Fig 4. Power derating curves 8.1 Thermal protection
The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10 % decrease at 130 °C and 30 % decrease at 145 °C (typical values on the spot of the thermal protection circuit). outputs 5 K/W thermal protection circuit 6 K/W fin mgk279
Fig 5. Equivalent thermal resistance network
9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 5 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents