Datasheet TDA6107AJF (Philips) - 4
| Fabricante | Philips |
| Descripción | Triple Video Output Amplifier |
| Páginas / Página | 16 / 4 — Philips Semiconductors. TDA6107AJF. Triple video output amplifier. … |
| Formato / tamaño de archivo | PDF / 97 Kb |
| Idioma del documento | Inglés |
Philips Semiconductors. TDA6107AJF. Triple video output amplifier. Internal circuitry. Fig 3. Internal pin configuration
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Philips Semiconductors TDA6107AJF Triple video output amplifier 6. Internal circuitry
GND VDD 4 6 to cascode stage to black-current
TDA6107AJF
measurement circuit 1, 2, 3 (1) esd from input flash circuit esd 7, 8, 9 esd to black-current V from bias esd measurement circuit input from circuit control circuit 5 from black- current esd measurement esd 6.8 V circuit from control circuit to black-current measurement circuit to black-current measurement circuit mce458 (1) All pins have an energy protection for positive or negative overstress situations.
Fig 3. Internal pin configuration 7. Limiting values Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specified in Figure 9; unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0 250 V Vi input voltage at pins Vi(1), Vi(2) and Vi(3) 0 12 V Vom measurement output voltage 0 6 V |Iom(mean)| absolute value of mean current of Voc = 0 V to VDD; - 5.6 mA measurement output (for three channels) Vom = 1.8 V to 6 V Voc cathode output voltage 0 VDD V Tstg storage temperature −55 +150 °C Tj junction temperature −20 +150 °C Vesd electrostatic discharge voltage Human Body Model (HBM) - ±3000 V Machine Model (MM) - ±300 V 9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 4 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents
Philips Semiconductors TDA6107AJF Triple video output amplifier 6. Internal circuitry
GND VDD 4 6 to cascode stage to black-current
TDA6107AJF
measurement circuit 1, 2, 3 (1) esd from input flash circuit esd 7, 8, 9 esd to black-current V from bias esd measurement circuit input from circuit control circuit 5 from black- current esd measurement esd 6.8 V circuit from control circuit to black-current measurement circuit to black-current measurement circuit mce458 (1) All pins have an energy protection for positive or negative overstress situations.
Fig 3. Internal pin configuration 7. Limiting values Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents as specified in Figure 9; unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0 250 V Vi input voltage at pins Vi(1), Vi(2) and Vi(3) 0 12 V Vom measurement output voltage 0 6 V |Iom(mean)| absolute value of mean current of Voc = 0 V to VDD; - 5.6 mA measurement output (for three channels) Vom = 1.8 V to 6 V Voc cathode output voltage 0 VDD V Tstg storage temperature −55 +150 °C Tj junction temperature −20 +150 °C Vesd electrostatic discharge voltage Human Body Model (HBM) - ±3000 V Machine Model (MM) - ±300 V 9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 4 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents