Datasheet TDA6107AJF (Philips) - 10

Philips Semiconductors TDA6107AJF Triple video output amplifier
To limit the diode current an external 1.5 kΩ carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB). VDD must be decoupled to GND: 1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be placed as close as possible to pins VDD and GND and must be within 5 mm. 2. With a capacitor > 3.3 µF on the picture tube base print, depending on the CRT size.
10.3 Switch-off behavior
The switch-off behavior of the TDA6107AJF is controllable. This is because the output pins of the TDA6107AJF are still under control of the input pins for low power supply voltages (approximately 30 V and higher).
10.4 Bandwidth
The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times.
10.5 Dissipation
A distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6107AJF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: Pstat = VDD × IDD + 3 × Voc × Ioc Where: VDD = supply voltage IDD = supply current Voc = DC value of cathode output voltage Ioc = DC value of cathode output current The dynamic dissipation Pdyn equals: Pdyn = 3 × VDD × (CL + Cint) × fi × Voc(p-p) × δ Where: CL = load capacitance Cint = internal load capacitance (≈4 pF) fi = input frequency Voc(p-p) = cathode output voltage (peak-to-peak value) δ = non-blanking duty cycle The TDA6107AJF must be mounted on the picture tube base print to minimize the load capacitance. 9397 750 14728 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 28 April 2005 10 of 16
Document Outline 1. General description 2. Features 3. Ordering information 4. Block diagram 5. Pinning information 5.1 Pinning 5.2 Pin description 6. Internal circuitry 7. Limiting values 8. Thermal characteristics 8.1 Thermal protection 9. Characteristics 10. Application information 10.1 Cathode output 10.2 Flashover protection 10.3 Switch-off behavior 10.4 Bandwidth 10.5 Dissipation 11. Test information 11.1 Quality information 12. Package outline 13. Handling information 14. Soldering 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Revision history 16. Data sheet status 17. Definitions 18. Disclaimers 19. Contact information 20. Contents