Datasheet BAT46 (STMicroelectronics) - 8
| Fabricante | STMicroelectronics |
| Descripción | Small signal Schottky diodes |
| Páginas / Página | 11 / 8 — Package information. BAT46 Series. Table 7. SOT-23 dimensions. … |
| Formato / tamaño de archivo | PDF / 158 Kb |
| Idioma del documento | Inglés |
Package information. BAT46 Series. Table 7. SOT-23 dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 14
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Package information BAT46 Series Table 7. SOT-23 dimensions Dimensions Ref. Millimeters Inches A E Min. Max. Min. Max.
A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004
e B e1 D
B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007
S
D 2.75 3.04 0.108 0.12
A1
e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083
c L
E 1.2 1.6 0.047 0.063
H
H 2.1 2.75 0.083 0.108 L 0.6 typ. 0.024 typ. S 0.35 0.65 0.014 0.026
Figure 14. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25
8/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history
A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004
e B e1 D
B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007
S
D 2.75 3.04 0.108 0.12
A1
e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083
c L
E 1.2 1.6 0.047 0.063
H
H 2.1 2.75 0.083 0.108 L 0.6 typ. 0.024 typ. S 0.35 0.65 0.014 0.026
Figure 14. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25
8/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history