Datasheet BAT46 (STMicroelectronics)

FabricanteSTMicroelectronics
DescripciónSmall signal Schottky diodes
Páginas / Página11 / 1 — BAT46 Series. Main product characteristics. BAT46ZFILM. (Single). …
Formato / tamaño de archivoPDF / 158 Kb
Idioma del documentoInglés

BAT46 Series. Main product characteristics. BAT46ZFILM. (Single). SOD-123. Features and benefits. BAT46JFILM (Single). SOD-323

Datasheet BAT46 STMicroelectronics

Línea de modelo para esta hoja de datos

Versión de texto del documento

BAT46 Series
Small signal Schottky diodes
Main product characteristics
I
BAT46ZFILM
F 150 mA
(Single)
VRRM 100 V C (typ) 6 pF
SOD-123
Tj (max) 150° C
Features and benefits BAT46JFILM (Single)
■ Very small conduction losses
SOD-323
■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount device
BAT46FILM Description (Single)
Diodes in the BAT46 series are high voltage,
BAT46AFILM
small signal Schottky diodes suited for protection
SOT-23 (Common anode)
and routing operations.
BAT46CFILM (Common cathode) Order codes BAT46SFILM Part Number Marking (Series)
BAT46ZFILM Z46 BAT46FILM S46 BAT46AFILM A46
BAT46WFILM
BAT46CFILM C46
(Single)
BAT46SFILM B46
BAT46AWFILM
BAT46WFILM D46
SOT-323 (Common anode)
BAT46AWFILM DB6
BAT46CWFILM
BAT46CWFILM DB8
(Common cathode)
BAT46SWFILM B46 BAT46JFILM 46
BAT46SWFILM (Series) Configurations in top view
July 2006 Rev 4 1/11 www.st.com Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history