Datasheet BAT46 (STMicroelectronics) - 7
| Fabricante | STMicroelectronics |
| Descripción | Small signal Schottky diodes |
| Páginas / Página | 11 / 7 — BAT46 Series. Package information. Table 6. SOD-323 dimensions. … |
| Formato / tamaño de archivo | PDF / 158 Kb |
| Idioma del documento | Inglés |
BAT46 Series. Package information. Table 6. SOD-323 dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 13
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BAT46 Series Package information Table 6. SOD-323 dimensions Dimensions H A1 Ref. Millimeters Inches b Min. Max. Min. Max. E
A 1.17 0.046 A1 0 0.1 0 0.004
A
b 0.25 0.44 0.01 0.017
D
c 0.1 0.25 0.004 0.01
c
D 1.52 1.8 0.06 0.071
Q1
E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106
L
L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016
Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06
7/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history
A 1.17 0.046 A1 0 0.1 0 0.004
A
b 0.25 0.44 0.01 0.017
D
c 0.1 0.25 0.004 0.01
c
D 1.52 1.8 0.06 0.071
Q1
E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106
L
L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016
Figure 13. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.06
7/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history