Datasheet ADL5320 (Analog Devices) - 10
| Fabricante | Analog Devices |
| Descripción | 400 MHz TO 2700 MHz ¼ Watt RF Driver Amplifier |
| Páginas / Página | 20 / 10 — ADL5320. Data Sheet. RCE. 42.0. 42.8. 43.6. 44.4. 45.2. 46.0. 46.8. 47.6. … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 919 Kb |
| Idioma del documento | Inglés |
ADL5320. Data Sheet. RCE. 42.0. 42.8. 43.6. 44.4. 45.2. 46.0. 46.8. 47.6. 3.80. 3.88. 3.96. 4.04. 4.12. 4.20. 4.28. OIP3 (dBm). NF (dB). 120. 115. 5.25V. 110. mA). 105
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ADL5320 Data Sheet 18 50 16 14 40 12 %) %) ( ( E E 30 10 AG AG NT NT 8 RCE 20 RCE E 6 E P P 4 10 2
021 024
0
05840-
0
05840-
42.0 42.8 43.6 44.4 45.2 46.0 46.8 47.6 3.80 3.88 3.96 4.04 4.12 4.20 4.28 OIP3 (dBm) NF (dB)
Figure 22. OIP3 Distribution at 880 MHz Figure 25. Noise Figure Distribution at 880 MHz
60 120 115 50 5.25V 110 40 mA) %) ( ( 105 5.0V E NT AG 30 100 NT CURRE Y RCE L E 95 P P 20 4.75V UP S 90 10 85
022 025
0
05840-
80 24.4 24.8 25.2 25.6 26.0 26.4 26.8
05840-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 P1dB (dBm) TEMPERATURE (°C)
Figure 23. P1dB Distribution at 880 MHz Figure 26. Supply Current vs. Supply Voltage and Temperature (Using 880 MHz Matching Components)
240 30 220 5V, +25°C 3.3V, +25°C 5V, –40°C 3.3V, –40°C 200 25 5V, +85°C 3.3V, +85°C 180 5V, +105°C 3.3V, +105°C mA) ( 160 20 NT %) ( 140 E AG CURRE 120 15 NT Y L P 100 RCE UP E S P 10 80 60 5
040
40
023 05840-
20 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 0
05840-
16.65 16.75 16.85 16.95 17.05 17.15 17.25 POUT PER TONE (dBm) GAIN (dB)
Figure 24. Gain Distribution at 880 MHz Figure 27. Supply Current vs. POUT and Temperature (2140 MHz Matching Components) Rev. B | Page 10 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
021 024
0
05840-
0
05840-
42.0 42.8 43.6 44.4 45.2 46.0 46.8 47.6 3.80 3.88 3.96 4.04 4.12 4.20 4.28 OIP3 (dBm) NF (dB)
Figure 22. OIP3 Distribution at 880 MHz Figure 25. Noise Figure Distribution at 880 MHz
60 120 115 50 5.25V 110 40 mA) %) ( ( 105 5.0V E NT AG 30 100 NT CURRE Y RCE L E 95 P P 20 4.75V UP S 90 10 85
022 025
0
05840-
80 24.4 24.8 25.2 25.6 26.0 26.4 26.8
05840-
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 P1dB (dBm) TEMPERATURE (°C)
Figure 23. P1dB Distribution at 880 MHz Figure 26. Supply Current vs. Supply Voltage and Temperature (Using 880 MHz Matching Components)
240 30 220 5V, +25°C 3.3V, +25°C 5V, –40°C 3.3V, –40°C 200 25 5V, +85°C 3.3V, +85°C 180 5V, +105°C 3.3V, +105°C mA) ( 160 20 NT %) ( 140 E AG CURRE 120 15 NT Y L P 100 RCE UP E S P 10 80 60 5
040
40
023 05840-
20 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 0
05840-
16.65 16.75 16.85 16.95 17.05 17.15 17.25 POUT PER TONE (dBm) GAIN (dB)
Figure 24. Gain Distribution at 880 MHz Figure 27. Supply Current vs. POUT and Temperature (2140 MHz Matching Components) Rev. B | Page 10 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide