Datasheet ADL5320 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 400 MHz TO 2700 MHz ¼ Watt RF Driver Amplifier |
| Páginas / Página | 20 / 2 — ADL5320. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 10/13—Rev. A to … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 919 Kb |
| Idioma del documento | Inglés |
ADL5320. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 10/13—Rev. A to Rev. B. 6/12—Rev. 0 to Rev. A
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ADL5320 Data Sheet TABLE OF CONTENTS
Features .. 1 High Temperature and 3.3 V Operation ... 11 Applications ... 1 Applications Information .. 12 Functional Block Diagram .. 1 Basic Layout Connections ... 12 General Description ... 1 Soldering Information and Recommended PCB Revision History ... 2 Land Pattern .. 13 Specifications ... 3 Matching Procedure ... 14 Typical Scattering Parameters ... 4 Optimizing OP1dB .. 15 Absolute Maximum Ratings .. 5 W-CDMA ACPR Performance .. 15 Thermal Resistance .. 5 Evaluation Board .. 16 ESD Caution .. 5 Outline Dimensions ... 18 Pin Configuration and Function Descriptions ... 6 Ordering Guide .. 18 Typical Performance Characteristics ... 7
REVISION HISTORY 10/13—Rev. A to Rev. B
Changes to Operating Temperature Range Parameter, Changed 1805 MHz to 2110 MHz .. Throughout Table 3 ... 5 Changes to Figure 27 .. 10 Added Thermal Resistance Section and Table 4; Renumbered Changes to Figure 34 and Table 6 ... 12 Sequentially .. 5 Changes to Figure 35 .. 13 Added EPAD Notation to Figure 3 ... 6 Changes to Matching Procedures Section ... 14 Added Figure 27 ... 10 Added Optimizing OP1dB Section, Table 10, Table 11, Added High Temperature and 3.3 V Operation Section and Table 12, and Figure 39; Renumbered Sequentially ... 15 Figure 28 to Figure 33 .. 11 Changes to Evaluation Board Section ... 16 Added Applications Information Section and Figure 35 .. 12 Updated Outline Dimensions ... 18 Changes to Soldering Information and Recommended PCB Changes to Ordering Guide .. 18 Land Pattern .. 12 Changed −82 dBc to −80 dBc in W-CDMA ACPR Performance
6/12—Rev. 0 to Rev. A
Section .. 14 Changes to Features Section and General Description Section . ... .. 1 Added Figure 39 ... 14 Added Application Section and Figure 2; Renumbered Updated Outline Dimensions ... 17 Sequentially ... 1 Changes to Specifications Section .. 3
2/08—Revision 0: Initial Version
Deleted θJC (Junction to Paddle) Parameter, Table 3 .. 5 Rev. B | Page 2 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
ADL5320 Data Sheet TABLE OF CONTENTS
Features .. 1 High Temperature and 3.3 V Operation ... 11 Applications ... 1 Applications Information .. 12 Functional Block Diagram .. 1 Basic Layout Connections ... 12 General Description ... 1 Soldering Information and Recommended PCB Revision History ... 2 Land Pattern .. 13 Specifications ... 3 Matching Procedure ... 14 Typical Scattering Parameters ... 4 Optimizing OP1dB .. 15 Absolute Maximum Ratings .. 5 W-CDMA ACPR Performance .. 15 Thermal Resistance .. 5 Evaluation Board .. 16 ESD Caution .. 5 Outline Dimensions ... 18 Pin Configuration and Function Descriptions ... 6 Ordering Guide .. 18 Typical Performance Characteristics ... 7
REVISION HISTORY 10/13—Rev. A to Rev. B
Changes to Operating Temperature Range Parameter, Changed 1805 MHz to 2110 MHz .. Throughout Table 3 ... 5 Changes to Figure 27 .. 10 Added Thermal Resistance Section and Table 4; Renumbered Changes to Figure 34 and Table 6 ... 12 Sequentially .. 5 Changes to Figure 35 .. 13 Added EPAD Notation to Figure 3 ... 6 Changes to Matching Procedures Section ... 14 Added Figure 27 ... 10 Added Optimizing OP1dB Section, Table 10, Table 11, Added High Temperature and 3.3 V Operation Section and Table 12, and Figure 39; Renumbered Sequentially ... 15 Figure 28 to Figure 33 .. 11 Changes to Evaluation Board Section ... 16 Added Applications Information Section and Figure 35 .. 12 Updated Outline Dimensions ... 18 Changes to Soldering Information and Recommended PCB Changes to Ordering Guide .. 18 Land Pattern .. 12 Changed −82 dBc to −80 dBc in W-CDMA ACPR Performance
6/12—Rev. 0 to Rev. A
Section .. 14 Changes to Features Section and General Description Section . ... .. 1 Added Figure 39 ... 14 Added Application Section and Figure 2; Renumbered Updated Outline Dimensions ... 17 Sequentially ... 1 Changes to Specifications Section .. 3
2/08—Revision 0: Initial Version
Deleted θJC (Junction to Paddle) Parameter, Table 3 .. 5 Rev. B | Page 2 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide