81 GHz to 86 GHz, E-Band Power Amplifier with Power Detector
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16 /10 — HMC8142. Data Sheet. 580. GAIN (dB) P1dB (dBm). 560. Bm). SAT (dBm). 540. …
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HMC8142. Data Sheet. 580. GAIN (dB) P1dB (dBm). 560. Bm). SAT (dBm). 540. , P. 520. N (. mA). B (. , G. 500. I DD. Bm) d. 480. OUT. GAIN. PAE. 460. 440. –15 –13 –11
HMC8142Data Sheet302858029GAIN (dB) P1dB (dBm)24560PBm)28SAT (dBm)%)d((20AE540AT27S, P, PB)26d16520Bm)N (dmA)25AI(B (, G12500I DD1d24, PBm) dB)23(d8480UTPN (OOUT22PAIGAING4PAE460I21DD044020–15 –13 –11–9–7–5–3–11357911 030 350400450 027 INPUT POWER (dBm)I 13425- DD (mA) 13425- Figure 27. Gain, Output P1dB, and PSAT vs. Drain Current (IDD) Figure 30. POUT, Gain, PAE, and IDD vs. Input Power at RF = 81 GHz, at RF = 86 GHz Drain Current (IDD) = 450 mA 28580285802456024560%) (%) (20AE54020AE540, P, PB) dB)16520d16520N (mA)N (mA)AI(AI(, G12500I DD, G12500I DDBm) dBm)(d8480(8480UT OUTPPPOUTOUTOPGAIN4GAIN4604460PAEPAEIIDDDD04400440–15 –13 –11–9–7–5–3–11357911 028 –15 –13 –11–9–7–5–3–11357911 031 INPUT POWER (dBm) 13425- INPUT POWER (dBm) 13425- Figure 28. POUT, Gain, PAE, and IDD vs. Input Power at RF = 83.5 GHz, Figure 31. POUT, Gain, PAE, and IDD vs. Input Power at RF = 86 GHz, Drain Current (IDD) = 450 mA Drain Current (IDD) = 450 mA 28560285602453024530%)%)((20AE50020AE500, P, PB)B)d16470d16470N (mA)N (mA)AI(AI(, G12440I DD, G12440I DDBm)Bm)dd(8410(8410UTUTOOPPOUTPPOUT4GAIN3804GAIN380PAEPAEIDDIDD03500350–15 –13 –11–9–7–5–3–11357911 029 –15 –13 –11–9–7–5–3–11357911 032 INPUT POWER (dBm) 13425- INPUT POWER (dBm) 13425- Figure 29. POUT, Gain, PAE, and IDD vs. Input Power at RF = 81 GHz, Figure 32. POUT, Gain, PAE, and IDD vs. Input Power at RF = 83.5 GHz, Drain Current (IDD) = 350 mA Drain Current (IDD) = 350 mA Rev. A | Page 10 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE