Datasheet HMC8142 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 81 GHz to 86 GHz, E-Band Power Amplifier with Power Detector |
| Páginas / Página | 16 / 8 — HMC8142. Data Sheet. TA = +85°C. DD = 350mA. A = +25°C. DD = 400mA. A = … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 319 Kb |
| Idioma del documento | Inglés |
HMC8142. Data Sheet. TA = +85°C. DD = 350mA. A = +25°C. DD = 400mA. A = –55°C. IDD = 450mA. Bm). B (. 81.0. 81.5. 82.0. 82.5. 83.0. 83.5. 84.0. 84.5. 85.0
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HMC8142 Data Sheet 30 30 29 TA = +85°C 29 I T DD = 350mA A = +25°C I T DD = 400mA 28 A = –55°C 28 IDD = 450mA 27 27 26 26 Bm) Bm) d d 25 25 B ( B ( 1d 1d P 24 P 24 23 23 22 22 21 21 20 20 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
015
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
018
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 15. Output P1dB vs. Frequency at Various Temperatures, Figure 18. Output P1dB vs. Frequency at Various Drain Currents (IDD) Drain Current (IDD) = 450 mA
30 30 29 29 IDD = 350mA IDD = 400mA 28 28 IDD = 450mA 27 27 26 26 Bm) Bm) d d ( 25 ( 25 AT AT S S P 24 P 24 23 T 23 A = +85°C TA = +25°C 22 T 22 A = –55°C 21 21 20 20 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
016
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
019
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 16. PSAT vs. Frequency at Various Temperatures, Figure 19. PSAT vs. Frequency at Various Drain Currents (IDD) Drain Current (IDD) = 450 mA
35 35 34 34 IDD = 350mA IDD = 400mA 33 33 IDD = 450mA 32 32 31 31 Bm) Bm) d 30 d 30 3 ( 3 ( IP 29 IP 29 28 T 28 A = +85°C TA = +25°C 27 T 27 A = –55°C 26 26 25 25 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
017
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
020
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 17. Output IP3 vs. Frequency at Various Temperatures, Figure 20. Output IP3 vs. Frequency at Various Drain Currents (IDD), Drain Current (IDD) = 450 mA, POUT/Tone = 12 dBm POUT/Tone = 12 dBm Rev. A | Page 8 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
015
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
018
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 15. Output P1dB vs. Frequency at Various Temperatures, Figure 18. Output P1dB vs. Frequency at Various Drain Currents (IDD) Drain Current (IDD) = 450 mA
30 30 29 29 IDD = 350mA IDD = 400mA 28 28 IDD = 450mA 27 27 26 26 Bm) Bm) d d ( 25 ( 25 AT AT S S P 24 P 24 23 T 23 A = +85°C TA = +25°C 22 T 22 A = –55°C 21 21 20 20 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
016
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
019
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 16. PSAT vs. Frequency at Various Temperatures, Figure 19. PSAT vs. Frequency at Various Drain Currents (IDD) Drain Current (IDD) = 450 mA
35 35 34 34 IDD = 350mA IDD = 400mA 33 33 IDD = 450mA 32 32 31 31 Bm) Bm) d 30 d 30 3 ( 3 ( IP 29 IP 29 28 T 28 A = +85°C TA = +25°C 27 T 27 A = –55°C 26 26 25 25 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
017
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
020
FREQUENCY (GHz)
13425-
FREQUENCY (GHz)
13425- Figure 17. Output IP3 vs. Frequency at Various Temperatures, Figure 20. Output IP3 vs. Frequency at Various Drain Currents (IDD), Drain Current (IDD) = 450 mA, POUT/Tone = 12 dBm POUT/Tone = 12 dBm Rev. A | Page 8 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE