Datasheet HMC8142 (Analog Devices) - 2

FabricanteAnalog Devices
Descripción81 GHz to 86 GHz, E-Band Power Amplifier with Power Detector
Páginas / Página16 / 2 — HMC8142. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 2/16—Revision A: …
RevisiónA
Formato / tamaño de archivoPDF / 319 Kb
Idioma del documentoInglés

HMC8142. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 2/16—Revision A: Initial Version

HMC8142 Data Sheet TABLE OF CONTENTS REVISION HISTORY 2/16—Revision A: Initial Version

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HMC8142 Data Sheet TABLE OF CONTENTS
Features .. 1 Theory of Operation .. 12 Applications ... 1 Applications Information .. 13 General Description ... 1 Typical Application Circuit ... 13 Functional Block Diagram .. 1 Assembly Diagram ... 14 Revision History ... 2 Mounting and Bonding Techniques for Millimeterwave Specifications ... 3 GaAs MMICs .. 15 Absolute Maximum Ratings .. 4 Handling Precautions .. 15 Thermal Resistance .. 4 Mounting ... 15 ESD Caution .. 4 Wire Bonding .. 15 Pin Configuration and Function Descriptions ... 5 Outline Dimensions ... 16 Interface Schematics... 6 Ordering Guide .. 16 Typical Performance Characteristics ... 7
REVISION HISTORY 2/16—Revision A: Initial Version
Rev. A | Page 2 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE