Datasheet AD532 (Analog Devices) - 5

Data Sheet AD532 THERMAL RESISTANCE
θJA is specified for the worst case conditions, that is, a device
CHIP DIMENSIONS AND BONDING DIAGRAM
soldered in a circuit board for surface-mount packages. Contact factory for the latest dimensions. Dimensions are
Table 2. Thermal Resistance
shown in inches and (millimeters).
Package Type θJA θJC Unit 0.107 (2.718)
H-10A 150 25 °C/W
–VS OUTPUT
D-14 85 22 °C/W
Z X1 0.062 (1.575) +VS Y1
002
X GND V Y 2 OS 2
00502- Figure 2.
ESD CAUTION
Rev. E | Page 5 of 14 Document Outline Features Applications General Description Flexibility of Operation Functional Block Diagram Guaranteed Performance Over Temperature Advantages of On The Chip Trimming of The Monolithic AD532 Revision History Specifications Thermal Resistance Chip Dimensions And Bonding Diagram ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Functional Description AD532 Performance Characteristics Nonlinearity AC Feedthrough Common-Mode Rejection Dynamic Characteristics Power Supply Considerations Noise Characteristics Applications Replacing Other IC Multipliers Multiplication Squaring Division Square Root Additional Information Outline Dimensions Ordering Guide