Datasheet LND150, LND250 (Microchip) - 14
| Fabricante | Microchip |
| Descripción | N-Channel Depletion-Mode DMOS FETs |
| Páginas / Página | 16 / 14 — LND150/LND250. PRODUCT IDENTIFICATION SYSTEM. PART NO. Examples:. Device. … |
| Formato / tamaño de archivo | PDF / 1.3 Mb |
| Idioma del documento | Inglés |
LND150/LND250. PRODUCT IDENTIFICATION SYSTEM. PART NO. Examples:. Device. Package Environmental. Media. Options. Type
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LND150/LND250 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. XX - X - X Examples: Device Package Environmental Media Options Type
a) LND150N3-G: N-Channel Depletion-Mode DMOS FET, 3-lead TO-92, Devices: LND150 = N-Channel Depletion-Mode DMOS FET 1000/Bag LND250 = N-Channel Depletion-Mode DMOS FET b) LND150K1-G: N-Channel Depletion-Mode Packages: N3 = 3-lead TO-92 DMOS FET, 3-lead SOT-23, K1 = 3-lead SOT-23 3000/Reel N8 = 3-lead SOT-89 c) LND150N8-G: N-Channel Depletion-Mode Environmental: G = Lead (Pb)-free/ROHS-compliant package DMOS FET, 3-lead TO-92, 2000/Reel Media Types: (blank) = 1000/Bag for an N3 package = 3000/Reel for a K1 package d) LND150N3-G-P002: N-Channel Depletion-Mode = 2000/Reel for an N8 package DMOS FET, 3-lead TO-92, P002 = 2000/Reel for an N3 package 2000/Reel P003 = 2000/Reel for an N3 package P013 = 2000/AMMO Pack for an N3 package P014 = 2000/AMMO Pack for an N3 package
Note: LND250 is only offered in 3-lead SOT-23 package.
DS20005454A-page 14 2018 Microchip Technology Inc. Document Outline N-Channel Depletion-Mode DMOS FETs Features Applications General Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics Temperature Specifications Thermal Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: Drain Current vs. RSOURCE. FIGURE 2-11: VGS(OFF) and RDS Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: TO-92 Pin Function Table TABLE 3-2: SOT-23 Pin Function Table TABLE 3-3: SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Revision A (August 2018) Product Identification System Worldwide Sales and Service
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. XX - X - X Examples: Device Package Environmental Media Options Type
a) LND150N3-G: N-Channel Depletion-Mode DMOS FET, 3-lead TO-92, Devices: LND150 = N-Channel Depletion-Mode DMOS FET 1000/Bag LND250 = N-Channel Depletion-Mode DMOS FET b) LND150K1-G: N-Channel Depletion-Mode Packages: N3 = 3-lead TO-92 DMOS FET, 3-lead SOT-23, K1 = 3-lead SOT-23 3000/Reel N8 = 3-lead SOT-89 c) LND150N8-G: N-Channel Depletion-Mode Environmental: G = Lead (Pb)-free/ROHS-compliant package DMOS FET, 3-lead TO-92, 2000/Reel Media Types: (blank) = 1000/Bag for an N3 package = 3000/Reel for a K1 package d) LND150N3-G-P002: N-Channel Depletion-Mode = 2000/Reel for an N8 package DMOS FET, 3-lead TO-92, P002 = 2000/Reel for an N3 package 2000/Reel P003 = 2000/Reel for an N3 package P013 = 2000/AMMO Pack for an N3 package P014 = 2000/AMMO Pack for an N3 package
Note: LND250 is only offered in 3-lead SOT-23 package.
DS20005454A-page 14 2018 Microchip Technology Inc. Document Outline N-Channel Depletion-Mode DMOS FETs Features Applications General Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics Temperature Specifications Thermal Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: Drain Current vs. RSOURCE. FIGURE 2-11: VGS(OFF) and RDS Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: TO-92 Pin Function Table TABLE 3-2: SOT-23 Pin Function Table TABLE 3-3: SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Revision A (August 2018) Product Identification System Worldwide Sales and Service