Datasheet SQJ457EP (Vishay)
| Fabricante | Vishay |
| Descripción | Automotive P-Channel 60 V (D-S) 175 °C MOSFET |
| Páginas / Página | 10 / 1 — SQJ457EP. Automotive P-Channel 60 V (D-S) 175 °C MOSFET. FEATURES. … |
| Formato / tamaño de archivo | PDF / 212 Kb |
| Idioma del documento | Inglés |
SQJ457EP. Automotive P-Channel 60 V (D-S) 175 °C MOSFET. FEATURES. PRODUCT SUMMARY. PowerPAK® SO-8L Single
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SQJ457EP
www.vishay.com Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY
• TrenchFET® power MOSFET VDS (V) -60 • AEC-Q101 qualified RDS(on) () at VGS = -10 V 0.0250 • 100 % R R g and UIS tested DS(on) () at VGS = -4.5 V 0.0350 I • Material categorization: D (A) -36 for definitions of compliance please see Configuration Single www.vishay.com/doc?99912 Package PowerPAK SO-8L
PowerPAK® SO-8L Single
S G D 1 6.15 mm 2 S S 3 S 4 D 1 5.13 mm G P-Channel MOSFET Top View Bottom View
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS -60 V Gate-Source Voltage VGS ± 20 TC = 25 °C -36 Continuous Drain Current ID TC = 125 °C -21 Continuous Source Current (Diode Conduction) a IS -60 A Pulsed Drain Current b IDM -100 Single Pulse Avalanche Current IAS -36 L = 0.1 mH Single Pulse Avalanche Energy EAS 64.8 mJ TC = 25 °C 68 Maximum Power Dissipation b PD W TC = 125 °C 22 Operating Junction and Storage Temperature Range TJ, Tstg -55 to +175 °C Soldering Recommendations (Peak Temperature) d, e 260
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient PCB Mountc RthJA 68 °C/W Junction-to-Case (Drain) RthJC 2.2
Notes
a. Package limited. b. Pulse test; pulse width 300 μs, duty cycle 2 %. c. When mounted on 1" square PCB (FR4 material). d. See solder profile (www.vishay.com/doc?73257). For PowerPAK SO-8L, the end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. S16-1123-Rev. A, 13-Jun-16
1
Document Number: 76628 For technical questions, contact: automostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY
• TrenchFET® power MOSFET VDS (V) -60 • AEC-Q101 qualified RDS(on) () at VGS = -10 V 0.0250 • 100 % R R g and UIS tested DS(on) () at VGS = -4.5 V 0.0350 I • Material categorization: D (A) -36 for definitions of compliance please see Configuration Single www.vishay.com/doc?99912 Package PowerPAK SO-8L
PowerPAK® SO-8L Single
S G D 1 6.15 mm 2 S S 3 S 4 D 1 5.13 mm G P-Channel MOSFET Top View Bottom View
ABSOLUTE MAXIMUM RATINGS
(TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage VDS -60 V Gate-Source Voltage VGS ± 20 TC = 25 °C -36 Continuous Drain Current ID TC = 125 °C -21 Continuous Source Current (Diode Conduction) a IS -60 A Pulsed Drain Current b IDM -100 Single Pulse Avalanche Current IAS -36 L = 0.1 mH Single Pulse Avalanche Energy EAS 64.8 mJ TC = 25 °C 68 Maximum Power Dissipation b PD W TC = 125 °C 22 Operating Junction and Storage Temperature Range TJ, Tstg -55 to +175 °C Soldering Recommendations (Peak Temperature) d, e 260
THERMAL RESISTANCE RATINGS PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient PCB Mountc RthJA 68 °C/W Junction-to-Case (Drain) RthJC 2.2
Notes
a. Package limited. b. Pulse test; pulse width 300 μs, duty cycle 2 %. c. When mounted on 1" square PCB (FR4 material). d. See solder profile (www.vishay.com/doc?73257). For PowerPAK SO-8L, the end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. S16-1123-Rev. A, 13-Jun-16
1
Document Number: 76628 For technical questions, contact: automostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000