Datasheet ZSSC4175D-01 (IDT) - 28

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11. ESD Protection and EMC Specification 11.1 ESD Protection
All pins have an ESD protection of ≥2000V according to the Human Body Model (HBM with 1.5kOhm/100pF, based on MIL883, Method 3015.7). The VDDE, VSSE, and DOUT pins have an additional ESD protection of ≥ 4000V (HBM with 1.5kΩ/100pF, based on MIL883, Method 3015.7). The levels of ESD protection are tested with devices in a 4  4 mm 24-QFN package during the product qualification.
11.2 Electromagnetic Emission
The wired emission of the externally connected pins of the ZSSC4175D-01 is measured according to the following standard: IEC 61967_4:2002 + A1:2006. Measurements must be performed with the application circuit described in Figure 8; SENT transmission uses a tick time of 9µs. For the off-board pins, the spectral power measured with the 150Ω method must not exceed the limits according to IEC 61967_4k, Annex B.4 code H10kN. For the VSSE pin, the spectral power measured with the 1Ω method must not exceed the limits according to IEC 61967_4k, Annex B.4 code H10kN.
11.3 Conducted Susceptibility (DPI)
The conducted susceptibility of externally connected pins of the device is measured according to the IEC 62132-4 standard: Measurements must be performed with the application circuit described in Figure 8; the thermocouples are replaced by 5Ω resistors connected between the bridge pins BR1P, BR1N, and BR2P, BR2N; SENT transmission uses a tick time of 9µs. Table 18 gives the specifications for the DPI tests. RES refers to the coupling impedance. CAP refers to the injection capacitance.
Table 18. Conducted Susceptibility (DPI) Tests Error No. Test Frequency Range Power Load Pins Protocol Band[a] Comment
DS_169 DPI, direct coupled 1MHz to 10MHz 20dBm VDDE, DOUT SENT ±1% RES = 50Ω CAP= 4.7nF DS_170 DPI, direct coupled >10MHz 30dBm VDDE, DOUT SENT ±1% RES = 50Ω CAP = 4.7nF [a] Error band regarding main signal (SENT FC1). © 2019 Integrated Device Technology, Inc. 28 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History