Datasheet ZSSC4175D-01 (IDT) - 2
Fabricante | IDT |
Descripción | Automotive Sensor Signal Conditioner for Thermocouples with SENT Output |
Páginas / Página | 35 / 2 — Contents |
Revisión | 20190607 |
Formato / tamaño de archivo | PDF / 783 Kb |
Idioma del documento | Inglés |
Contents
Línea de modelo para esta hoja de datos
Versión de texto del documento
link to page 5 link to page 5 link to page 6 link to page 7 link to page 8 link to page 8 link to page 9 link to page 9 link to page 9 link to page 9 link to page 10 link to page 11 link to page 11 link to page 11 link to page 11 link to page 12 link to page 12 link to page 13 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 14 link to page 15 link to page 15 link to page 15 link to page 15 link to page 15 link to page 16 link to page 17 link to page 18 link to page 19 ZSSC4175D-01 Datasheet
Contents
1. Pin Assignments ...5 2. Pin Descriptions ..5 3. Absolute Maximum Ratings ..6 4. Operating Conditions ..7 5. Electrical Characteristics ..8 5.1 Supply Current and System Operating Conditions ..8 5.2 Analog Front-End Characteristics ..9 5.3 Internal Temperature Measurement ..9 5.4 Thermocouple Measurement ...9 5.5 SENT Output ...9 5.6 System Response ...10 6. Interface Characteristics and Nonvolatile Memory ...11 6.1 I2C Interface – Only for production purposes ..11 6.2 ZACwire™ One-Wire Interface ..11 6.3 Nonvolatile Memory (NVM) ...11 7. Circuit Description ..12 7.1 General Operation Description ..12 7.2 Signal Path ..13 7.3 Signal Conditioning ..14 7.3.1 Thermocouple Sensor Signal Conditioning ..14 7.3.2 Internal Temperature Sensor Signal Conditioning ..14 7.4 Analog Front-End ..14 7.4.1 Overview ...14 7.4.2 SCCM ...14 7.4.3 Input Multiplexer ...14 7.4.4 Programmable Gain Amplifier ..14 7.4.5 Analog-to-Digital Converter ..14 7.5 Signal Measurement ..14 7.5.1 Thermocouple Element Measurement ...14 7.5.2 Internal Temperature Measurement ...14 7.5.3 Isolation Conductance Measurement (Giso) ..15 7.5.4 Thermocouple Resistor Measurement (Ropen) ..15 7.5.5 Measurement Cycle ..15 7.6 SENT Output ...15 7.6.1 Overview ...15 7.6.2 SENT Fast Channel Modes and Frame Format ...16 7.6.3 SENT SDM Channel Modes ...17 7.6.4 SENT Output Operation Modes ..18 7.6.5 SENT Pulse Shaping ..19 © 2019 Integrated Device Technology, Inc. 2 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History