Datasheet ZSSC4175D-01 (IDT) - 4
| Fabricante | IDT |
| Descripción | Automotive Sensor Signal Conditioner for Thermocouples with SENT Output |
| Páginas / Página | 35 / 4 — List of Tables |
| Revisión | 20190607 |
| Formato / tamaño de archivo | PDF / 783 Kb |
| Idioma del documento | Inglés |
List of Tables
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List of Tables
Table 1. Pin Descriptions ...5 Table 2. Absolute Maximum Ratings ...6 Table 3. Recommended Operating Conditions ..7 Table 4. Electrical Parameters ...8 Table 5. Interface Characteristics and Nonvolatile Memory ...11 Table 6. Requirements – SENT Output Protocol ...16 Table 7. Requirements – SENT Fast Channel Modes and Frame Format ..16 Table 8. Example of SDM ID Priority Level and Sequence Configuration ...17 Table 9. Requirements – SENT Output Operation Modes and Initialization Behavior ...18 Table 10. NVM OEM Data Memory ...19 Table 11. Over-Voltage, Reverse-Polarity, and Short-Circuit Protection ...19 Table 12. Timing Parameter ..22 Table 13. Firmware Monitors ...23 Table 14. Fault Check Threshold Definition ...24 Table 15. Application Monitors ...25 Table 16. SENT Transmission Monitors ..26 Table 17. Dimensioning of External Components for the Application Example ...27 Table 18. Conducted Susceptibility (DPI) Tests ...28 Table 19. Ambient Temperature Profile (Example) ..29 © 2019 Integrated Device Technology, Inc. 4 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History
List of Tables
Table 1. Pin Descriptions ...5 Table 2. Absolute Maximum Ratings ...6 Table 3. Recommended Operating Conditions ..7 Table 4. Electrical Parameters ...8 Table 5. Interface Characteristics and Nonvolatile Memory ...11 Table 6. Requirements – SENT Output Protocol ...16 Table 7. Requirements – SENT Fast Channel Modes and Frame Format ..16 Table 8. Example of SDM ID Priority Level and Sequence Configuration ...17 Table 9. Requirements – SENT Output Operation Modes and Initialization Behavior ...18 Table 10. NVM OEM Data Memory ...19 Table 11. Over-Voltage, Reverse-Polarity, and Short-Circuit Protection ...19 Table 12. Timing Parameter ..22 Table 13. Firmware Monitors ...23 Table 14. Fault Check Threshold Definition ...24 Table 15. Application Monitors ...25 Table 16. SENT Transmission Monitors ..26 Table 17. Dimensioning of External Components for the Application Example ...27 Table 18. Conducted Susceptibility (DPI) Tests ...28 Table 19. Ambient Temperature Profile (Example) ..29 © 2019 Integrated Device Technology, Inc. 4 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History