Datasheet ADL6010S (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | Aerospace ADL6010S Fast Responding, 45 dB Range, 0.5 GHz TO 43.5 GHz Envelope Detector |
| Páginas / Página | 8 / 7 — ADL6010S. Table III – Life Test / Burn-in Delta Limits. Parameter Symbol. … |
| Revisión | C |
| Formato / tamaño de archivo | PDF / 199 Kb |
| Idioma del documento | Inglés |
ADL6010S. Table III – Life Test / Burn-in Delta Limits. Parameter Symbol. Condition. Delta. Unit. 5.0. Die Outline
Versión de texto del documento
ADL6010S Table III – Life Test / Burn-in Delta Limits Parameter Symbol Condition Delta Unit
Dynamic Supply Current VPOS I RFin = +10dBm, 1GHz POS ±300 uA Frequency = 500MHz, ±0.2 V RFin = +10dBm Output Voltages Vout Frequency = 500MHz, ±0.08 V RFin = -10dBm
5.0 Die Outline Table IV – Pad Identification Pad Description Pad Size (mils)
1 RFCM 2.6 x 5.4 2 RFIN 2.6 x 6.2 3 RFCM 2.6 x 5.4 4 VPOS 2.6 x 2.6 5 VOUT 2.7 x 2.6 6 COMM 2.6 x 5.4 Notes: 1. All dimensions are in mils. 2. Die Thickness is 12 mils. 3. Bond metallization: Aluminum Copper 4. Overall Die Size +/- 2 mils. 5. No connection required for unlabeled bond pads. ASD0016585 Rev. C | Page 7 of 8
Dynamic Supply Current VPOS I RFin = +10dBm, 1GHz POS ±300 uA Frequency = 500MHz, ±0.2 V RFin = +10dBm Output Voltages Vout Frequency = 500MHz, ±0.08 V RFin = -10dBm
5.0 Die Outline Table IV – Pad Identification Pad Description Pad Size (mils)
1 RFCM 2.6 x 5.4 2 RFIN 2.6 x 6.2 3 RFCM 2.6 x 5.4 4 VPOS 2.6 x 2.6 5 VOUT 2.7 x 2.6 6 COMM 2.6 x 5.4 Notes: 1. All dimensions are in mils. 2. Die Thickness is 12 mils. 3. Bond metallization: Aluminum Copper 4. Overall Die Size +/- 2 mils. 5. No connection required for unlabeled bond pads. ASD0016585 Rev. C | Page 7 of 8