Datasheet LTC1100 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | Precision, Zero-Drift Instrumentation Amplifier |
| Páginas / Página | 8 / 8 — PACKAGE DESCRIPTIO. J8 Package. 8-Lead CERDIP (Narrow .300 Inch, … |
| Formato / tamaño de archivo | PDF / 143 Kb |
| Idioma del documento | Inglés |
PACKAGE DESCRIPTIO. J8 Package. 8-Lead CERDIP (Narrow .300 Inch, Hermetic). OBSOLETE PACKAGE. N8 Package
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LTC1100
U PACKAGE DESCRIPTIO J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .405 (10.287) .200 .005 .300 BSC MAX CORNER LEADS OPTION (5.080) (0.127) (7.62 BSC) (4 PLCS) MAX MIN 8 7 6 5 .015 – .060 .023 – .045 (0.381 – 1.524) .025 .220 – .310 (0.584 – 1.143) (0.635) HALF LEAD (5.588 – 7.874) RAD TYP .008 – .018 OPTION 0° – 15° (0.203 – 0.457) .045 – .068 (1.143 – 1.650) 1 2 3 4 FULL LEAD .045 – .065 OPTION .125 (1.143 – 1.651) 3.175 NOTE: LEAD DIMENSIONS APPLY TO SOLDER MIN .014 – .026 DIP/PLATE OR TIN PLATE LEADS .100 (0.360 – 0.660) (2.54) J8 0801 BSC
OBSOLETE PACKAGE N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .300 – .325 .045 – .065 .130 ± .005 .400* (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) (10.160) NOTE: MAX 1. DIMENSIONS INCHES .065 8 7 6 5 ARE MILLIMETERS (1.651) *THESE DIMENSIONS .008 – .015 TYP DO NOT INCLUDE .120 (0.203 – 0.381) .255 ± .015* MOLD FLASH OR (3.048) .020 PROTRUSIONS. (6.477 ± 0.381) +.035 MIN (0.508) MOLD FLASH OR .325 –.015 MIN PROTRUSIONS .100 .018 ± .003 +0.889 SHALL NOT EXCEED 8.255 (2.54) (0.457 ± 0.076) –0.381 ( ) .010 INCH (0.254mm) N8 1002 1 2 3 4 BSC
SW Package 16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620) .030 ±.005 .050 BSC .045 ±.005 .398 – .413 TYP (10.109 – 10.490) NOTE 4 N 16 15 14 13 12 11 10 9 N .420 .325 ±.005 MIN NOTE 3 .394 – .419 (10.007 – 10.643) N/2 1 2 3 N/2 NOTE: RECOMMENDED SOLDER PAD LAYOUT INCHES 1. DIMENSIONS IN 1 2 3 4 5 6 7 8 (MILLIMETERS) 2. DRAWING NOT TO SCALE .291 – .299 3. PIN 1 IDENT, NOTCH ON (7.391 – 7.595) TOP AND CAVITIES ON THE NOTE 4 .037 – .045 BOTTOM OF PACKAGES .093 – .104 .010 – .029 (0.940 – 1.143) ARE THE MANUFACTURING × 45° (2.362 – 2.642) (0.254 – 0.737) OPTIONS. THE PART MAY BE .005 SUPPLIED WITH OR WITHOUT (0.127) ANY OF THE OPTIONS. RAD MIN 0° – 8° TYP 4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT .050 EXCEED .006" (0.15mm) .004 – .012 .009 – .013 (1.270) (0.102 – 0.305) NOTE 3 (0.229 – 0.330) BSC .014 – .019 .016 – .050 (0.356 – 0.482) (0.406 – 1.270) TYP S16 (WIDE) 0502 1100fc LW/TP 1202 1K REV C • PRINTED IN USA 8 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 1994
U PACKAGE DESCRIPTIO J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) .405 (10.287) .200 .005 .300 BSC MAX CORNER LEADS OPTION (5.080) (0.127) (7.62 BSC) (4 PLCS) MAX MIN 8 7 6 5 .015 – .060 .023 – .045 (0.381 – 1.524) .025 .220 – .310 (0.584 – 1.143) (0.635) HALF LEAD (5.588 – 7.874) RAD TYP .008 – .018 OPTION 0° – 15° (0.203 – 0.457) .045 – .068 (1.143 – 1.650) 1 2 3 4 FULL LEAD .045 – .065 OPTION .125 (1.143 – 1.651) 3.175 NOTE: LEAD DIMENSIONS APPLY TO SOLDER MIN .014 – .026 DIP/PLATE OR TIN PLATE LEADS .100 (0.360 – 0.660) (2.54) J8 0801 BSC
OBSOLETE PACKAGE N8 Package 8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510) .300 – .325 .045 – .065 .130 ± .005 .400* (7.620 – 8.255) (1.143 – 1.651) (3.302 ± 0.127) (10.160) NOTE: MAX 1. DIMENSIONS INCHES .065 8 7 6 5 ARE MILLIMETERS (1.651) *THESE DIMENSIONS .008 – .015 TYP DO NOT INCLUDE .120 (0.203 – 0.381) .255 ± .015* MOLD FLASH OR (3.048) .020 PROTRUSIONS. (6.477 ± 0.381) +.035 MIN (0.508) MOLD FLASH OR .325 –.015 MIN PROTRUSIONS .100 .018 ± .003 +0.889 SHALL NOT EXCEED 8.255 (2.54) (0.457 ± 0.076) –0.381 ( ) .010 INCH (0.254mm) N8 1002 1 2 3 4 BSC
SW Package 16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620) .030 ±.005 .050 BSC .045 ±.005 .398 – .413 TYP (10.109 – 10.490) NOTE 4 N 16 15 14 13 12 11 10 9 N .420 .325 ±.005 MIN NOTE 3 .394 – .419 (10.007 – 10.643) N/2 1 2 3 N/2 NOTE: RECOMMENDED SOLDER PAD LAYOUT INCHES 1. DIMENSIONS IN 1 2 3 4 5 6 7 8 (MILLIMETERS) 2. DRAWING NOT TO SCALE .291 – .299 3. PIN 1 IDENT, NOTCH ON (7.391 – 7.595) TOP AND CAVITIES ON THE NOTE 4 .037 – .045 BOTTOM OF PACKAGES .093 – .104 .010 – .029 (0.940 – 1.143) ARE THE MANUFACTURING × 45° (2.362 – 2.642) (0.254 – 0.737) OPTIONS. THE PART MAY BE .005 SUPPLIED WITH OR WITHOUT (0.127) ANY OF THE OPTIONS. RAD MIN 0° – 8° TYP 4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT .050 EXCEED .006" (0.15mm) .004 – .012 .009 – .013 (1.270) (0.102 – 0.305) NOTE 3 (0.229 – 0.330) BSC .014 – .019 .016 – .050 (0.356 – 0.482) (0.406 – 1.270) TYP S16 (WIDE) 0502 1100fc LW/TP 1202 1K REV C • PRINTED IN USA 8 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 1994