Datasheet LT1236LS8 (Analog Devices) - 3

FabricanteAnalog Devices
DescripciónPrecision, Low Noise, Low Profile Hermetic Voltage Reference
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elecTrical characTerisTics. The. denotes the specifications which apply over the full operating

elecTrical characTerisTics The denotes the specifications which apply over the full operating

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LT1236LS8
elecTrical characTerisTics The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 10V, IOUT = 0, unless otherwise noted. LT1236LS8-5 PARAMETER CONDITIONS MIN TYP MAX UNITS
Load Regulation (Sinking Current) 0 ≤ IOUT ≤ 10mA 60 100 ppm/mA (Note 4) l 150 ppm/mA Supply Current 0.8 1.2 mA l 1.5 mA Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 3.0 µVP-P (Note 5) 10Hz ≤ f ≤ 1kHz 2.2 3.5 µVRMS Long-Term Stability of Output Voltage (Note 6) ∆t = 1000Hrs Non-Cumulative 20 ppm Temperature Hysteresis of Output (Note 7) ∆T = ±25°C 3 ppm ∆T = 0°C to 70°C 8 ppm ∆T = –40°C to 85°C 60 ppm
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 6:
Long-term stability typically has a logarithmic characteristic and may cause permanent damage to the device. Exposure to any Absolute therefore, changes after 1000 hours tend to be much smaller than before Maximum Rating condition for extended periods may affect device that time. Total drift in the second thousand hours is normally less than reliability and lifetime. one third that of the first thousand hours, with a continuing trend toward
Note 2:
Output voltage is measured immediately after turn-on. Changes reduced drift with time. Significant improvement in long-term drift can due to chip warm-up are typically less than 0.005%. be realized by preconditioning the IC with a 100-200 hour, 125°C burn in.
Note 3:
Temperature coefficient is measured by dividing the change in Long term stability will also be affected by differential stresses between output voltage over the temperature range by the change in temperature. the IC and the board material created during board assembly. Temperature
Incremental slope is also measured at 25°C.
cycling and baking of completed boards is often used to reduce these stresses in critical applications.
Note 4:
Line and load regulation are measured on a pulse basis. Output changes due to die temperature change must be taken into account
Note 7:
Hysteresis in output voltage is created by package stress that separately. differs depending on whether the IC was previously at a higher or lower temperature. Output voltage is always measured at 25°C, but the IC is
Note 5:
RMS noise is measured with a 2-pole highpass filter at 10Hz and a cycled to high or low temperature before successive measurements. 2-pole lowpass filter at 1kHz. The resulting output is full-wave rectified and Hysteresis is roughly proportional to the square of temperature change. then integrated for a fixed period, making the final reading an average as Hysteresis is not normally a problem for operational temperature opposed to RMS. Correction factors are used to convert from average to excursions, but can be significant in critical narrow temperature range RMS, and 0.88 is used to correct for the non-ideal bandbass of the filters. applications where the instrument might be stored at high or low Peak-to-peak noise is measured with a single highpass filter at 0.1Hz and a temperatures. Hysteresis measurements are preconditioned by one 2-pole lowpass filter at 10Hz. The unit is enclosed in a still-air environment temperature cycle. to eliminate thermocouple effects on the leads. Test time is 10 seconds. 1236ls8f 3 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Typical Application Related Parts