Datasheet PCF8574, PCF8574A (NXP) - 3

NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt Table 2. Ordering options
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Type number Orderable Package Packing method Minimum Temperature range part number order quantity
PCF8574TS/3 PCF8574TS/3,112 SSOP20 Standard marking 1350 Tamb = 40 C to +85 C * IC’s tube - DSC bulk pack PCF8574TS/3,118 SSOP20 Reel 13” Q1/T1 2500 Tamb = 40 C to +85 C *standard mark SMD PCF8574ATS/3 PCF8574ATS/3,118 SSOP20 Reel 13” Q1/T1 2500 Tamb = 40 C to +85 C *standard mark SMD
5. Block diagram PCF8574 PCF8574A
INTERRUPT INT LP FILTER LOGIC A0 P0 A1 P1 A2 P2 SCL 8 bits INPUT I2C-BUS SHIFT I/O P3 FILTER CONTROL REGISTER PORT P4 SDA P5 P6 P7 write pulse read pulse POWER-ON VDD RESET VSS 002aad624
Fig 1. Block diagram
VDD write pulse IOH 100 μA Itrt(pu) data from Shift Register D Q FF P0 to P7 CI IOL S power-on reset VSS D Q FF read pulse CI S to interrupt logic data to Shift Register 002aac109
Fig 2. Simplified schematic diagram of P0 to P7
PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 27 May 2013 3 of 33
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 4.1 Ordering options 5. Block diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Device address 7.1.1 Address maps 8. I/O programming 8.1 Quasi-bidirectional I/Os 8.2 Writing to the port (Output mode) 8.3 Reading from a port (Input mode) 8.4 Power-on reset 8.5 Interrupt output (INT) 9. Characteristics of the I2C-bus 9.1 Bit transfer 9.1.1 START and STOP conditions 9.2 System configuration 9.3 Acknowledge 10. Application design-in information 10.1 Bidirectional I/O expander applications 10.2 How to read and write to I/O expander (example) 10.3 High current-drive load applications 10.4 Migration path 11. Limiting values 12. Thermal characteristics 13. Static characteristics 14. Dynamic characteristics 15. Package outline 16. Handling information 17. Soldering of SMD packages 17.1 Introduction to soldering 17.2 Wave and reflow soldering 17.3 Wave soldering 17.4 Reflow soldering 18. Soldering of through-hole mount packages 18.1 Introduction to soldering through-hole mount packages 18.2 Soldering by dipping or by solder wave 18.3 Manual soldering 18.4 Package related soldering information 19. Soldering: PCB footprints 20. Abbreviations 21. Revision history 22. Legal information 22.1 Data sheet status 22.2 Definitions 22.3 Disclaimers 22.4 Trademarks 23. Contact information 24. Contents