Datasheet PCF8574, PCF8574A (NXP) - 2

NXP Semiconductors PCF8574; PCF8574A Remote 8-bit I/O expander for I2C-bus with interrupt
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA Packages offered: DIP16, SO16, SSOP20
3. Applications
LED signs and displays Servers Key pads Industrial control Medical equipment PLC Cellular telephones Mobile devices Gaming machines Instrumentation and test measurement
4. Ordering information Table 1. Ordering information Type number Topside mark Package Name Description Version
PCF8574P PCF8574P DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 PCF8574AP PCF8574AP PCF8574T/3 PCF8574T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 PCF8574AT/3 PCF8574AT PCF8574TS/3 8574TS SSOP20 plastic shrink small outline package; 20 leads; SOT266-1 body width 4.4 mm PCF8574ATS/3 8574A
4.1 Ordering options Table 2. Ordering options Type number Orderable Package Packing method Minimum Temperature range part number order quantity
PCF8574P PCF8574P,112 DIP16 Standard marking 1000 Tamb = 40 C to +85 C * IC’s tube - DSC bulk pack PCF8574AP PCF8574AP,112 DIP16 Standard marking 1000 Tamb = 40 C to +85 C * IC’s tube - DSC bulk pack PCF8574T/3 PCF8574T/3,512 SO16 Standard marking 1920 Tamb = 40 C to +85 C * tube dry pack PCF8574T/3,518 SO16 Reel 13” Q1/T1 1000 Tamb = 40 C to +85 C *standard mark SMD dry pack PCF8574AT/3 PCF8574AT/3,512 SO16 Standard marking 1920 Tamb = 40 C to +85 C * tube dry pack PCF8574AT/3,518 SO16 Reel 13” Q1/T1 1000 Tamb = 40 C to +85 C *standard mark SMD dry pack PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 27 May 2013 2 of 33
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 4.1 Ordering options 5. Block diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Device address 7.1.1 Address maps 8. I/O programming 8.1 Quasi-bidirectional I/Os 8.2 Writing to the port (Output mode) 8.3 Reading from a port (Input mode) 8.4 Power-on reset 8.5 Interrupt output (INT) 9. Characteristics of the I2C-bus 9.1 Bit transfer 9.1.1 START and STOP conditions 9.2 System configuration 9.3 Acknowledge 10. Application design-in information 10.1 Bidirectional I/O expander applications 10.2 How to read and write to I/O expander (example) 10.3 High current-drive load applications 10.4 Migration path 11. Limiting values 12. Thermal characteristics 13. Static characteristics 14. Dynamic characteristics 15. Package outline 16. Handling information 17. Soldering of SMD packages 17.1 Introduction to soldering 17.2 Wave and reflow soldering 17.3 Wave soldering 17.4 Reflow soldering 18. Soldering of through-hole mount packages 18.1 Introduction to soldering through-hole mount packages 18.2 Soldering by dipping or by solder wave 18.3 Manual soldering 18.4 Package related soldering information 19. Soldering: PCB footprints 20. Abbreviations 21. Revision history 22. Legal information 22.1 Data sheet status 22.2 Definitions 22.3 Disclaimers 22.4 Trademarks 23. Contact information 24. Contents