EPC2102 – Enhancement-Mode GaN Power Transistor Half BridgePreliminary Specification SheetFeatures: • 98% System Efficiency at 18 A o 42 VIN to 14 VOUT, 500 kHz o Includes driver, inductor, and output filter • High Frequency Operation • High Density Footprint EPC2102 devices are supplied only in • Low Inductance Package passivated die form with solder balls Pb-Free (RoHS Compliant), Halogen Free Die Size: 6.05 mm x 2.3 mm Applications: • High Frequency DC-DC Conversion Typical System Efficiency9998.5Typical Circuit)98(% y 97.5c n e97ci96.5Effi96f95.5sw=300 kHzfsw=500 kHz9502468101214161820222426Output Current (A)VIN = 42 V, VOUT = 14 VMAXIMUM RATINGSParameterValue Maximum Drain – Source Voltage (VSW to PGND, VIN to VSW) 60 V Maximum Gate – Source Voltage Range (Gate 1 to VSW, Gate 2 to PGND) -4 V < VGS < 6 V Q1 Control FET 23 A Continuous Drain Current, 25 °C, RθJA = 28 (Q1), 28 (Q2) Q2 Sync FET 23 A Q1 Control FET 215 A Maximum Pulsed Drain Current, 25 °C, Tpulse = 300 µs Q2 Sync FET 215 A Optimum Temperature Range -40 °C < TJ < 150 °C Subject to Change without Notice www.epc-co.com COPYRIGHT 2015 Page 1