Datasheet ADRF5010 (Analog Devices) - 5

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ADRF5010 ABSOLUTE MAXIMUM RATINGS
For recommended operating conditions, see Table 1.
Table 4. Thermal Resistance 1 Table 3. Absolute Maximum Ratings Package Type θJC Unit Parameter Rating
CC-14-5 Through Path 135 °C/W Positive Supply Voltage −0.3 V to +3.6 V Terminated Path 50 °C/W Negative Supply Voltage −3.6 V to +0.3 V Digital Control Input1 1 θJC was determined by simulation under the following conditions: The heat Voltage −0.3 V to V transfer is due solely to the thermal conduction from the channel through the DD + 0.3 V Current 3 mA ground pad to the PCB, and the ground pad is held constant at the operating RF Input Power, Dual Supply2 (V temperature of 85°C. DD = 3.3 V, VSS = −3.3 V, f = 0.1 GHz to 55 GHz, TCASE = 85°C3)
POWER DERATING CURVES
Through Path 37 dBm Terminated Path 33.5 dBm Hot Switching (RF1/2 to Termination) 33.5 dBm RF Input Power, Single Supply (VDD = 3.3 V, VSS = 0 V, f = 0.1 GHz to 55 GHz, TCASE = 85°C3) Through Path 20 dBm Terminated Path 20 dBm Hot Switching (RF1/2 to Termination) 20 dBm RF Input Power, Unbiased 30 dBm (VDD, VSS = 0 V) Temperature Junction, TJ 135°C Storage −65°C to +150°C Reflow 260°C 1 Overvoltages at the digital control input are clamped by internal diodes.
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
Current must be limited to the maximum rating given. 2 For power derating over frequency, see Figure 2. 3 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB for dual supply. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at a time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction-to-case bottom (channel-to-package bottom) thermal resistance.
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Document Outline Features Applications Functional Block Diagram General Description Specifications Single-Supply Operation Absolute Maximum Ratings Thermal Resistance Power Derating Curves Electrostatıc Dıscharge (ESD) Ratıngs ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Insertion Loss, Return Loss, and Isolation Input Power Compression and Third-Order Intercept Theory of Operation RF Input And Output Applications Information Evaluation Board Recommendatıons For Printed Circuit Board Design Outline Dimensions Ordering Guide Evaluation Boards