Datasheet ADRF5010 (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | Silicon SPST Switch, NonReflective, 100 MHz to 55 GHz |
| Páginas / Página | 12 / 4 — ADRF5010. SPECIFICATIONS. Table 1. Electrical Specifications (Continued). … |
| Formato / tamaño de archivo | PDF / 665 Kb |
| Idioma del documento | Inglés |
ADRF5010. SPECIFICATIONS. Table 1. Electrical Specifications (Continued). Parameter. Symbol. Test Conditions/Comments. Min. Typ. Max
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ADRF5010 SPECIFICATIONS Table 1. Electrical Specifications (Continued) Parameter Symbol Test Conditions/Comments Min Typ Max Unit
CW 30 dBm Case Temperature TCASE −40 +85 °C 1 For input linearity performance over frequency, see Figure 12 to Figure 15. 2 For power derating over frequency, see Figure 2. 3 Peak: ( ≤100 ns pulse duration, 5% duty cycle). 4 Pulse: (>100 ns pulse duration, 15% duty cycle).
SINGLE-SUPPLY OPERATION
VDD = 3.3 V, VSS = 0, VCTRL = 0 V or VDD, TCASE = 25°C for 50 Ω system, unless otherwise noted. RFx refers to RF1 or RF2
Table 2. Single-Supply Operation Specifications Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE f 0.1 55 GHz SWITCHING CHARACTERISTICS Rise Time and Fall Time tRISE, tFALL 10% to 90% of RF output 50 ns On Time and Off Time tON, tOFF 50% VCTRL to 90% of RF output 85 ns Settling Time (0.1 dB) 50% VCTRL to 0.1 dB of final RF output 120 ns INPUT LINEARITY f = 0.1 GHz to 55 GHz Input Compression P0.1dB 18 dBm Third-Order Intercept IP3 Two-tone input power = 6 dBm each tone, f = 0.1 53 dBm GHz to 55 GHz, Δf = 1 MHz RECOMMENDED OPERATING CONDITONS RF Input Power PIN f = 0.1 GHz to 55 GHz, TCASE = 85°C Through Path RF signal is applied to RFx at Insertion Loss state 18 dBm Terminated Path RF signal is applied to RFx at Isolation state 18 dBm Hot Switching RF signal is applied to RFx while switching in be- 18 dBm tween Insertion Loss and Isolation states
analog.com Rev. 0 | 4 of 12
Document Outline Features Applications Functional Block Diagram General Description Specifications Single-Supply Operation Absolute Maximum Ratings Thermal Resistance Power Derating Curves Electrostatıc Dıscharge (ESD) Ratıngs ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Insertion Loss, Return Loss, and Isolation Input Power Compression and Third-Order Intercept Theory of Operation RF Input And Output Applications Information Evaluation Board Recommendatıons For Printed Circuit Board Design Outline Dimensions Ordering Guide Evaluation Boards
ADRF5010 SPECIFICATIONS Table 1. Electrical Specifications (Continued) Parameter Symbol Test Conditions/Comments Min Typ Max Unit
CW 30 dBm Case Temperature TCASE −40 +85 °C 1 For input linearity performance over frequency, see Figure 12 to Figure 15. 2 For power derating over frequency, see Figure 2. 3 Peak: ( ≤100 ns pulse duration, 5% duty cycle). 4 Pulse: (>100 ns pulse duration, 15% duty cycle).
SINGLE-SUPPLY OPERATION
VDD = 3.3 V, VSS = 0, VCTRL = 0 V or VDD, TCASE = 25°C for 50 Ω system, unless otherwise noted. RFx refers to RF1 or RF2
Table 2. Single-Supply Operation Specifications Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE f 0.1 55 GHz SWITCHING CHARACTERISTICS Rise Time and Fall Time tRISE, tFALL 10% to 90% of RF output 50 ns On Time and Off Time tON, tOFF 50% VCTRL to 90% of RF output 85 ns Settling Time (0.1 dB) 50% VCTRL to 0.1 dB of final RF output 120 ns INPUT LINEARITY f = 0.1 GHz to 55 GHz Input Compression P0.1dB 18 dBm Third-Order Intercept IP3 Two-tone input power = 6 dBm each tone, f = 0.1 53 dBm GHz to 55 GHz, Δf = 1 MHz RECOMMENDED OPERATING CONDITONS RF Input Power PIN f = 0.1 GHz to 55 GHz, TCASE = 85°C Through Path RF signal is applied to RFx at Insertion Loss state 18 dBm Terminated Path RF signal is applied to RFx at Isolation state 18 dBm Hot Switching RF signal is applied to RFx while switching in be- 18 dBm tween Insertion Loss and Isolation states
analog.com Rev. 0 | 4 of 12
Document Outline Features Applications Functional Block Diagram General Description Specifications Single-Supply Operation Absolute Maximum Ratings Thermal Resistance Power Derating Curves Electrostatıc Dıscharge (ESD) Ratıngs ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Insertion Loss, Return Loss, and Isolation Input Power Compression and Third-Order Intercept Theory of Operation RF Input And Output Applications Information Evaluation Board Recommendatıons For Printed Circuit Board Design Outline Dimensions Ordering Guide Evaluation Boards