Datasheet TLV9101, TLV9102, TLV9104 (Texas Instruments) - 2

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TLV9101, TL V9102, TLV9104
SBOS943E – FEBRUARY 2019 – REVISED AUGUST 2021
www.ti.com Table of Contents 1 Features
..1 7.4 Device Functional Modes..31
2 Applications
... 1
8 Application and Implementation
... 32
3 Description
...1 8.1 Application Information... 32
4 Revision History
.. 2 8.2 Typical Applications.. 32
5 Pin Configuration and Functions
...4
9 Power Supply Recommendations
..34
6 Specifications
.. 10
10 Layout
...34 6.1 Absolute Maximum Ratings ... 10 10.1 Layout Guidelines... 34 6.2 ESD Ratings .. 10 10.2 Layout Example.. 34 6.3 Recommended Operating Conditions ..10
11 Device and Documentation Support
..37 6.4 Thermal Information for Single Channel .. 10 11.1 Device Support..37 6.5 Thermal Information for Dual Channel ... 11 11.2 Documentation Support.. 37 6.6 Thermal Information for Quad Channel ..11 11.3 Receiving Notification of Documentation Updates.. 37 6.7 Electrical Characteristics ..12 11.4 Support Resources... 37 6.8 Typical Characteristics.. 15 11.5 Trademarks... 37
7 Detailed Description
..23 11.6 Electrostatic Discharge Caution.. 37 7.1 Overview... 23 11.7 Glossary.. 37 7.2 Functional Block Diagram... 23
12 Mechanical, Packaging, and Orderable
7.3 Feature Description...24
Information
.. 38
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (June 2021) to Revision E (August 2021) Page
• Removed preview notation from TLV9102 VSSOP (8) package from Device Information table.. 1 • Removed preview notation from TLV9102 VSSOP-8 (DGK) package in the Pin Configuration and Functions section.. 4 • Removed preview note and added thermal data for VSSOP-8 (DGK) package in Thermal Information for Dual Channel. ...11 • Added clarifying statement regarding logic low signal for SHDN pin in the Shutdown section ..30 • Corrected statement on shutdown enable and disable times in the Shutdown section from 30 μs and 3 μs to 11 μs and 2.5 μs, respectively, to match the Electrical Characteristics section.. 30
Changes from Revision C (May 2020) to Revision D (June 2021) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..1 • Removed preview notation from TLV9104 SOIC (14) package from Device Information table..1 • Removed preview notation from TLV9104 TSSOP (14) package from Device Information table.. 1 • Removed preview notation from TLV9102 SOT-23 (8) package from Device Information table.. 1 • Removed preview notation from TLV9104 WQFN (16) package from Device Information table..1 • Removed preview notation from TLV9101 DBV package (SOT-23) in the Pin Configuration and Functions section.. 4 • Adjusted DRL pinout in the Pin Configuration and Functions section.. 4 • Removed preview notation from TLV9101 DCK package (SC70) in the Pin Configuration and Functions section.. 4 • Removed preview notation from TLV9101S DBV package (SOT-23) in the Pin Configuration and Functions section.. 4 • Clarified shutdown notation in the Pin Configuration and Functions section.. 4 • Removed preview notation from TLV9102 DDF package (SOT-23-8) in the Pin Configuration and Functions section.. 4 • Removed preview notation from TLV9104 SOIC (D) and TSSOP (PW) packages in the Pin Configuration and Functions section..4 • Removed preview notation from TLV9104 X2QFN (RUC) package in the Pin Configuration and Functions section.. 4 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TLV9101 TLV9102 TLV9104 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information for Single Channel 6.5 Thermal Information for Dual Channel 6.6 Thermal Information for Quad Channel 6.7 Electrical Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 EMI Rejection 7.3.2 Phase Reversal Protection 7.3.3 Thermal Protection 7.3.4 Capacitive Load and Stability 7.3.5 Common-Mode Voltage Range 7.3.6 Electrical Overstress 7.3.7 Overload Recovery 7.3.8 Typical Specifications and Distributions 7.3.9 Packages With an Exposed Thermal Pad 7.3.10 Shutdown 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 High Voltage Precision Comparator 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Receiving Notification of Documentation Updates 11.4 Support Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information