Datasheet LMR1901YG-M (Rohm) - 3

LMR1901YG-M Absolute Maximum Ratings (Ta = 25 °C)
Parameter Symbol Rating Unit Supply Voltage (VDD - VSS) VS 7.0 V Input Pin Voltage (+IN, -IN) VI (VSS - 0.3) to (VDD + 0.3) V Input Pin Current (+IN, -IN) II ±10 mA Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operate over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ) Parameter Symbol Unit 1s(Note 3) 2s2p(Note 4) SSOP5 Junction to Ambient θJA 376.5 185.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 40 30 °C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Material Measurement Board Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Material Measurement Board Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit Single Supply 1.7 3.0 5.5 Supply Voltage (VDD - VSS) VS V Dual Supply ±0.85 ±1.50 ±2.75 Operating Temperature Topr -40 +25 +105 °C
Function Explanation
1. Nano Energy™ Nano Energy™ is a combination of technologies which realizes ultra low quiescent current operation. www.rohm.com
TSZ02201-0GLG2G800170-1-2
3 © 2023 ROHM Co., Ltd. All rights reserved. /21 TSZ22111 • 15 • 001
04.Aug.2023 Rev.001
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Pin Configuration Block Diagram Description of Blocks Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Function Explanation Electrical Characteristics Typical Performance Curves Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Ambient Temperature Figure 3. Output Voltage High vs Supply Voltage Figure 4. Output Voltage High vs Ambient Temperature Figure 5. Output Voltage Low vs Supply Voltage Figure 6. Output Voltage Low vs Ambient Temperature Figure 7. Output Source Current vs Output Voltage Figure 8. Output Sink Current vs Output Voltage Figure 9. Output Source Current vs Output Voltage Figure 10. Output Sink Current vs Output Voltage Figure 11. Input Offset Voltage vs Supply Voltage Figure 12. Input Offset Voltage vs Ambient Temperature Figure 13. Input Offset Voltage vs Supply Voltage Figure 14. Input Offset Voltage vs Ambient Temperature Figure 15. Input Offset Voltage vs Common-mode Input Voltage Figure 16. Input Offset Voltage vs Common-mode Input Voltage Figure 17. Large Signal Voltage Gain vs Supply Voltage Figure 18. Large Signal Voltage Gain vs Ambient Temperature Figure 19. Common-mode Rejection Ratio vs Supply Voltage Figure 20. Common-mode Rejection Ratio vs Ambient Temperature Figure 21. Power Supply Rejection Ratio vs Ambient Temperature Figure 22. Input Bias Current vs Ambient Temperature Figure 23. Input-referred Noise Voltage Density vs Frequency Figure 24. Input-referred Noise Voltage Density vs Frequency Figure 25. Slew Rate vs Supply Voltage Figure 26. Slew Rate vs Ambient Temperature Figure 27. Slew Rate vs Ambient Temperature Figure 28. Gain Bandwidth Product vs Ambient Temperature Figure 29. Phase Margin vs Load Capacitance Figure 30. Phase Margin vs Load Capacitance Figure 31. Voltage Gain, Phase vs Frequency Figure 32. Voltage Gain, Phase vs Frequency Figure 33. Large-Signal Step Response Figure 34. Large-Signal Step Response Application Examples I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Testing on Application Boards 8. Inter-pin Short and Mounting Errors 9. Unused Input Pins 10. Regarding the Input Pin of the IC 11. Ceramic Capacitor Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History