Datasheet BAR42, BAR43 (STMicroelectronics) - 5

BAR42, BAR43 Package information 2 Package information
• Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Table 6. SOT23-3L dimensions Dimensions Ref. Millimeters Inches A Min. Max. Min. Max. E
A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004
e
B 0.3 0.51 0.012 0.02
B e1 D
c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12
S
e 0.85 1.05 0.033 0.041
A1
e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063
c L
H 2.1 2.75 0.083 0.108
H
L 0.6 typ. 0.024 typ. S 0.35 0.65 0.014 0.026
Figure 8. Footprint (dimensions in mm) 0.95 0.61 1.26 0.73 3.25
DocID3288 Rev 5 5/7 7 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameter Table 4. Static electrical characteristics Table 5. Dynamic characteristics (Tj = 25 °C) Figure 1. Forward voltage drop versus forward current (typical values, low level) Figure 2. Forward voltage drop versus forward current (typical values, high level) Figure 3. Reverse leakage current versus reverse voltage applied (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse voltage applied (typical values) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 7. Thermal resistance junction to ambient versus copper surface under each lead 2 Package information Table 6. SOT23-3L dimensions Figure 8. Footprint (dimensions in mm) 3 Ordering information Table 7. Ordering information 4 Revision history Table 8. Document revision history