S112S01 Series/S116S01 SeriesFig. 1 RMS ON-state Current vs. AmbientFig. 2 RMS ON-state Current vs. AmbientTemperature( S112S01Series)Temperature( S116S01Series) 18 12 ) (1) 16 (3) (2) (4) (1) (3) (2) Arms 10 Arms ( 14 T T (4) 12 8 10 6 8 4 6 (5) 4 RMS ON-state current I RMS On-state current I (5) 2 2 0 0 - 25 0 25 50 75 100 125 - 25 0 25 50 75 100 125 Ambient temperature T a (˚C) Ambient temperature T a (˚C) ( 1) With infinite heat sink ( 1) With infinite heat sink ( 2) With heat sink ( 280 x 280 x 2 mm Al plate) ( 2) With heat sink ( 280 x 280 x 2 mm Al plate ) ( 3) With heat sink ( 200 x 200 x 2 mm Al plate) ( 3) With heat sink ( 200 x 200 x 2 mm Al plate ) ( 4) With heat sink ( 100 x 100 x 2 mm Al plate) ( 4) With heat sink ( 100 x 100 x 2 mm Al plate ) ( 5) Without heat sink ( 5) Without heat sink ( Note) With the Al heat sink set up vertically,tighten the device at the center of the Al heat sink with a torque of 0.4N • m and apply thermal conductive silicone grease on the heat sink mounting plate. Forcible cooling shall not be carried out. Fig. 3 RMS ON-state Current vs.Fig. 4 Forward Current vs.Case TemperatureAmbient Temperature 16 60 S116S01Series 14 ) 50 12 ) Arms( S112S01Series mA T ( 40 10 F 8 30 6 20 Forward current I 4 RMS On-state current I 10 2 0 0 - 25 0 25 50 75 100 125 - 25 0 25 50 75 100 125 Case temperature T c (˚C) Ambient temperature T a (˚C)