Datasheet IR2153 (Infineon) - 2
| Fabricante | Infineon |
| Descripción | Self-Oscillating Half-Bridge Driver |
| Páginas / Página | 9 / 2 — IR2153(D)(S) & (PbF). NOTE:For new designs, we recommend IR’s new … |
| Formato / tamaño de archivo | PDF / 223 Kb |
| Idioma del documento | Inglés |
IR2153(D)(S) & (PbF). NOTE:For new designs, we recommend IR’s new product IRS2153D. Absolute Maximum Ratings
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IR2153(D)(S) & (PbF) NOTE:For new designs, we recommend IR’s new product IRS2153D Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param- eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage -0.3 625 VS High side floating supply offset voltage VB - 25 VB + 0.3 VHO High side floating output voltage VS - 0.3 VB + 0.3 V VLO Low side output voltage -0.3 VCC + 0.3 VRT RT pin voltage -0.3 VCC + 0.3 VCT CT pin voltage -0.3 VCC + 0.3 ICC Supply current (note 1) — 25 mA IRT RT pin current -5 5 dVs/dt Allowable offset voltage slew rate -50 50 V/ns PD Maximum power dissipation @ TA ≤ +25°C (8 Lead DIP) — 1.0 W (8 Lead SOIC) — 0.625 RthJA Thermal resistance, junction to ambient (8 Lead DIP) — 125 °C/W (8 Lead SOIC) — 200 TJ Junction temperature -55 150 TS Storage temperature -55 150 °C TL Lead temperature (soldering, 10 seconds) — 300
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol Definition Min. Max. Units
VBs High side floating supply voltage VCC - 0.7 VCLAMP VS Steady state high side floating supply offset voltage -3.0 (note 2) 600 V VCC Supply voltage 10 VCLAMP ICC Supply current (note 3) 5 mA TJ Junction temperature -40 125 °C Note 1: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics section. Note 2: Care should be taken to avoid output switching conditions where the VS node flies inductively below ground by more than 5V. Note 3: Enough current should be supplied to the VCC pin of the IC to keep the internal 15.6V zener diode clamping the voltage at this pin. 2 www.irf.com
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param- eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
VB High side floating supply voltage -0.3 625 VS High side floating supply offset voltage VB - 25 VB + 0.3 VHO High side floating output voltage VS - 0.3 VB + 0.3 V VLO Low side output voltage -0.3 VCC + 0.3 VRT RT pin voltage -0.3 VCC + 0.3 VCT CT pin voltage -0.3 VCC + 0.3 ICC Supply current (note 1) — 25 mA IRT RT pin current -5 5 dVs/dt Allowable offset voltage slew rate -50 50 V/ns PD Maximum power dissipation @ TA ≤ +25°C (8 Lead DIP) — 1.0 W (8 Lead SOIC) — 0.625 RthJA Thermal resistance, junction to ambient (8 Lead DIP) — 125 °C/W (8 Lead SOIC) — 200 TJ Junction temperature -55 150 TS Storage temperature -55 150 °C TL Lead temperature (soldering, 10 seconds) — 300
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Symbol Definition Min. Max. Units
VBs High side floating supply voltage VCC - 0.7 VCLAMP VS Steady state high side floating supply offset voltage -3.0 (note 2) 600 V VCC Supply voltage 10 VCLAMP ICC Supply current (note 3) 5 mA TJ Junction temperature -40 125 °C Note 1: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics section. Note 2: Care should be taken to avoid output switching conditions where the VS node flies inductively below ground by more than 5V. Note 3: Enough current should be supplied to the VCC pin of the IC to keep the internal 15.6V zener diode clamping the voltage at this pin. 2 www.irf.com