Datasheet NOA1212 (ON Semiconductor) - 8
| Fabricante | ON Semiconductor |
| Descripción | Ambient Light Sensor with Dark Current Compensation |
| Páginas / Página | 9 / 8 — PACKAGE DIMENSIONS. CUDFN6 1.6x1.6, 0.5P. SCALE 2:1. A B. PIN 1. … |
| Formato / tamaño de archivo | PDF / 171 Kb |
| Idioma del documento | Inglés |
PACKAGE DIMENSIONS. CUDFN6 1.6x1.6, 0.5P. SCALE 2:1. A B. PIN 1. MILLIMETERS. DIM. MIN. MAX. TOP VIEW. NOTE 4. C SEATING. SIDE VIEW. PLANE. GENERIC
Línea de modelo para esta hoja de datos
Versión de texto del documento
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS CUDFN6 1.6x1.6, 0.5P
CASE 505AL 1 ISSUE A
SCALE 2:1
DATE 09 FEB 2017 NOTES:
D A B
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED
PIN 1
TERMINAL AND IS MEASURED BETWEEN
E
0.10 AND 0.20MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED
2X
0.10 C PAD AS WELL AS THE TERMINALS.
MILLIMETERS 2X
0.10 C
DIM MIN MAX A
0.55 0.65
TOP VIEW A1
0.00 0.05
A3
0.20 REF
A b
0.15 0.25 0.10 C
A3 b2
0.15 REF
D
1.60 BSC
D2
1.05 1.15
E
1.60 BSC 0.08 C
E2
0.45 0.55
A1 NOTE 4 C SEATING e
0.50 BSC
SIDE VIEW PLANE L
0.25 0.35
L2
0.17 REF 0.10 M
GENERIC L2
C A B
D2 MARKING DIAGRAM* PIN ONE 6X L REFERENCE
1 3 *No marking due to clear package 0.10 M C A B
RECOMMENDED E2 b2 MOUNTING FOOTPRINT*
6 4 1.20 6X
6X b
0.48
e
0.10 C A B 0.05 C
NOTE 3 BOTTOM VIEW
0.60 1.90 1 6X 0.28 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON89262F
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: CUDFN6, 1.6X1.6, 0.5P PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS CUDFN6 1.6x1.6, 0.5P
CASE 505AL 1 ISSUE A
SCALE 2:1
DATE 09 FEB 2017 NOTES:
D A B
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED
PIN 1
TERMINAL AND IS MEASURED BETWEEN
E
0.10 AND 0.20MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED
2X
0.10 C PAD AS WELL AS THE TERMINALS.
MILLIMETERS 2X
0.10 C
DIM MIN MAX A
0.55 0.65
TOP VIEW A1
0.00 0.05
A3
0.20 REF
A b
0.15 0.25 0.10 C
A3 b2
0.15 REF
D
1.60 BSC
D2
1.05 1.15
E
1.60 BSC 0.08 C
E2
0.45 0.55
A1 NOTE 4 C SEATING e
0.50 BSC
SIDE VIEW PLANE L
0.25 0.35
L2
0.17 REF 0.10 M
GENERIC L2
C A B
D2 MARKING DIAGRAM* PIN ONE 6X L REFERENCE
1 3 *No marking due to clear package 0.10 M C A B
RECOMMENDED E2 b2 MOUNTING FOOTPRINT*
6 4 1.20 6X
6X b
0.48
e
0.10 C A B 0.05 C
NOTE 3 BOTTOM VIEW
0.60 1.90 1 6X 0.28 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON89262F
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: CUDFN6, 1.6X1.6, 0.5P PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com