Datasheet MC33023, MC34023 (ON Semiconductor) - 3

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MC34023, MC33023 ORDERING INFORMATION Device Package Shipping
† MC33023DWG SOIC−16W 47 Units / Rail (Pb−Free) MC33023DWR2G SOIC−16W 1000 Units / Reel (Pb−Free) MC34023PG PDIP−16 25 Units / Rail (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS Rating Symbol Value Unit
Power Supply Voltage VCC 30 V Output Driver Supply Voltage VC 20 V Output Current, Source or Sink (Note 1) IO A DC 0.5 Pulsed (0.5 ms) 2.0 Current Sense, Soft−Start, Ramp, and Error Amp Inputs Vin −0.3 to +7.0 V Error Amp Output and Soft−Start Sink Current IO 10 mA Clock and RT Output Current ICO 5.0 mA Power Dissipation and Thermal Characteristics SO−16L Package (Case 751G) Maximum Power Dissipation @ TA = +25°C PD 862 mW Thermal Resistance, Junction−to−Air RqJA 145 °C/W DIP Package (Case 648) Maximum Power Dissipation @ T 1.25 W A = + 25°C PD Thermal Resistance, Junction−to−Air R 100 °C/W qJA Operating Junction Temperature TJ +150 °C Operating Ambient Temperature (Note 2) °C MC34023 TA 0 to +70 MC33023 −40 to +105 Storage Temperature Range Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
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