Datasheet BAV199 (Nexperia) - 2
Fabricante | Nexperia |
Descripción | Low-leakage double diode |
Páginas / Página | 10 / 2 — Nexperia. BAV199. Low-leakage double diode. 6. Ordering information Table … |
Revisión | 01092020 |
Formato / tamaño de archivo | PDF / 209 Kb |
Idioma del documento | Inglés |
Nexperia. BAV199. Low-leakage double diode. 6. Ordering information Table 3. Ordering information. Type number. Package Name
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Nexperia BAV199 Low-leakage double diode 6. Ordering information Table 3. Ordering information Type number Package Name Description Version
BAV199 SOT23 plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 SOT23 mm x 1.3 mm x 1 mm body
7. Marking Table 4. Marking codes Type number Marking code[1]
BAV199 JY% [1] % = placeholder for manufacturing site code
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit Per diode
VR reverse voltage - 75 V VRRM repetitive peak reverse - 85 V voltage IF forward current single diode loaded - 160 mA double diode loaded - 140 mA IFRM repetitive peak forward - 500 mA current IFSM non-repetitive peak tp = 1 µs; square wave; Tj(init) = 25 °C - 4 A forward current tp = 1 ms; square wave; Tj(init) = 25 °C - 1 A tp = 1 s; square wave; Tj(init) = 25 °C - 0.5 A
Per device; one diode loaded
Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAV199 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 1 September 2020 2 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents