link to page 5 link to page 5 link to page 5 ADG733/ADG734ABSOLUTE MAXIMUM RATINGS1 Junction Temperature . 150°C (T 16-Lead TSSOP, θ A = 25°C, unless otherwise noted.) JA Thermal Impedance . 150.4°C/W V 20-Lead TSSOP, θJA Thermal Impedance . 143°C/W DD to VSS . 7 V V 16-Lead QSOP, θJA Thermal Impedance . 149.97°C/W DD to GND . –0.3 V to +7 V V Lead Temperature, Soldering (10 sec) . 300°C SS to GND . +0.3 V to –3.5 V Analog Inputs2 . V IR Reflow, Peak Temperature (<20 sec) . 235°C SS – 0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First NOTES Digital Inputs2 . –0.3 V to V 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- DD + 0.3 V or 30 mA, Whichever Occurs First nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational Peak Current, S or D . 100 mA sections of this specification is not implied. Exposure to absolute maximum rating (Pulsed at 1 ms, 10% Duty Cycle max) conditions for extended periods may affect device reliability. Only one absolute Continuous Current, S or D . 30 mA maximum rating may be applied at any one time. 2 Operating Temperature Range Overvoltages at A, EN, IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. Industrial (A, B Versions) . –40°C to +85°C Storage Temperature Range . –65°C to +150°C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG733/ADG734 feature proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. PIN CONFIGURATIONSTSSOP/QSOPTSSOPIN1 120 IN4S2B 116 V2DDS1A19 S4AS2A 215 D2D1 318 D4S3B 314ADG733D1S1B 417ADG734S4BD3 4TOP VIEW13 S1BVSS 5TOP VIEW16 VDD(Not to Scale)(Not to Scale)S3A 512 S1AGND 615 NCEN 611 A0S2B 714 S3BV710 A1SSD2 813 D3GND 89 A2S2A 912 S3AIN2 1011 IN3NC = NO CONNECT REV. B –5– Document Outline Features Applications General Description Functional Block Diagrams Product Highlights Specifications Absolute Maximum Ratings Pin Configurations Terminology Typical Performance Characteristics Test Circuits Outline Dimensions Ordering Guide Revision History