Si3430DV www.vishay.com Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOLTESTCONDITIONS MIN.TYP.MAX.UNITStatic Gate threshold voltage VGS(th) VDS = VDS, ID = 250 μA 2 - 4.2 V Gate-body leakage IGSS VDS = 0 V, VGS = ± 20 V - - ± 100 nA VDS = 80 V, VGS = 0 V - - 1 Zero gate voltage drain current IDSS μA VDS = 80 V, VGS = 0 V, TJ = 85 °C - - 25 On-state drain current a ID(on) VDS ≥ 5 V, VGS = 10 V 8 - - A VGS = 10 V, ID = 2.4 A - 0.148 0.170 Drain-source on-state resistance a RDS(on) Ω VGS = 6 V, ID = 2.3 A - 0.160 0.185 Forward transconductance a gfs VDS = 15 V, ID = 2.4 A - 7 - S Diode forward voltage a VSD IS= 1.7 A, VGS = 0 V - 0.8 1.2 V Dynamic b Total gate charge Qg - 5.5 8.2 Gate-source charge Qgs VDS = 50 V, VGS = 10 V, ID = 2.4 A - 1.5 - nC Gate-drain charge Qgd - 1.4 - Gate resistance Rg 1 - 4 Ω Turn-on delay time td(on) - 9 20 Rise time tr V - 11 20 DD = 50 V, RL = 50 Ω ns I Turn-off delay time t D ≅ 1 A, VGEN = 10 V, Rg = 6 Ω d(off) - 16 30 Fall time tf - 9 20 Gate resistance Rg VGS = 0.1 V, f = 5 MHz - 2.8 - Ω Source-drain reverse recovery time trr IF = 1.7 A, di/dt = 100 A/μs - 50 80 ns Notes a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 % b. Guaranteed by design, not subject to production testing Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S19-0836-Rev. E, 30-Sep-2019 2 Document Number: 71235 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000