Datasheet BUK7S0R5-40H (Nexperia) - 3

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Nexperia BUK7S0R5-40H N-channel 40 V, 0.5 mOhm standard level MOSFET in LFPAK88 Symbol Parameter Conditions Min Max Unit
VGS gate-source voltage DC; Tj = 175 °C -10 20 V Ptot total power dissipation Tmb = 25 °C; Fig. 1 - 375 W ID drain current VGS = 10 V; Tmb = 25 °C; Fig. 2 [1] - 500 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3 - 2237 A Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C
Source-drain diode
IS source current Tmb = 25 °C [1] - 500 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 2237 A
Avalanche ruggedness
EDS(AL)S non-repetitive drain- ID = 120 A; Vsup ≤ 40 V; RGS = 50 Ω; [2] [3] - 1375 mJ source avalanche energy VGS = 10 V; Tj(init) = 25 °C; unclamped; Fig. 4 IAS non-repetitive avalanche Vsup = 40 V; VGS = 10 V; Tj(init) = 25 °C; [4] - 315 A current RGS = 50 Ω; Fig. 4 [1] 500A continuous current has been successfully demonstrated during application. Practically the current will be limited by PCB, thermal design and operating temperature. [2] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C. [3] Refer to application note AN10273 for further information. [4] Protected by 100% test. 03aa16 120 aaa-032611 600 ID (A ( ) A Pder (%) 500 (1) 1 80 400 300 40 200 100 0 0 0 50 100 150 200 0 25 50 75 100 125 150 175 200 Tmb (°C) Tmb (°C) VGS ≥ 10 V (1) 500A continuous current has been successfully demonstrated during application tests. Practically
Fig. 1. Normalized total power dissipation as a
the current will be limited by PCB, thermal design
function of mounting base temperature
and operating temperature.
Fig. 2. Continuous drain current as a function of mounting base temperature
BUK7S0R5-40H All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. Al rights reserved
Product data sheet 6 April 2021 3 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Soldering 13. Legal information Contents