Datasheet LM25149-Q1 (Texas Instruments) - 6

FabricanteTexas Instruments
Descripción42-V Automotive Synchronous Buck DC/DC Controller with Ultra-Low IQ and Integrated Active EMI Filter
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LM25149-Q1. www.ti.com. MIN. NOM. MAX. UNIT. 7.4 Thermal Information. LM5149-Q1. THERMAL METRIC(1). RGY (VQFN). 24 PINS. NCE INFO

LM25149-Q1 www.ti.com MIN NOM MAX UNIT 7.4 Thermal Information LM5149-Q1 THERMAL METRIC(1) RGY (VQFN) 24 PINS NCE INFO

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LM25149-Q1
SNVSBV6 – DECEMBER 2020
www.ti.com
Over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Pin voltage AEFVDDA –0.3 5 V Pin voltage INJ to AEFGND –0.3 5 V Pin voltage SEN to AEFGND –0.3 36 V Pin voltage AEFGND to AVSS –0.3 0.3 V TJ Operating junction temperature –40 150 °C
7.4 Thermal Information LM5149-Q1 THERMAL METRIC(1) RGY (VQFN) UNIT 24 PINS AD
RθJA Junction-to-ambient thermal resistance 37.3 °C/W
V
RθJC(top) Junction-to-case (top) thermal resistance 32 °C/W
A
RθJB Junction-to-board thermal resistance 15.5 °C/W
NCE INFO
ψJT Junction-to-top characterization parameter 1.2 °C/W ψJB Junction-to-board characterization parameter 15.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 5.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics
7.5 Electrical Characteristics R
TJ = –40°C to +150°C, VIN = 8 V to 18 V. Typical values are at TJ = 25°C and VIN = 12 V (unless otherwise noted)
MA PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY (VIN) TION
Non-switching, V I EN = 0 V, VFB = VREF Q-VIN1 VIN shutdown current 2.2 3.8 µA + 50 mV IQ-VIN2 VIN standby current Non-switching, 0.5 V ≤ VEN ≤ 1 V 104 µA 1.03 V ≤ VEN ≤ 47 V, VVOUT = 3.3 V, in ISTANDBY1 Sleep current, 3.3 V regulation, no-load, not switching, 9.5 19.6 µA VPFM/VSYNC = 0 V VEN = 5 V, VVOUT = 5 V, in regulation, ISTANDBY2 Sleep current, 5 V no-load, not switching, VPFM/SYNC = 10 17.2 µA 0 V
ENABLE (EN)
VSDN Shutdown to standby threshold VEN rising 0.5 V VEN-HIGH Enable voltage rising threshold VEN rising, enable switching 0.95 1.0 1.05 V IEN-HYS Enable hystersis VEN = 1.1 V 8 10 12 µA
INTERNAL LDO (VCC)
VVCC-REG VCC regulation voltage IVCC = 0 mA to 100 mA 4.7 5 5.3 V VVCC-UVLO VCC UVLO rising threshold 3.3 3.4 3.5 V VVCC-HYST VCC UVLO hysteresis 130 mV IVCC-REG Internal LDO short-circuit current limit 110 170 mA
INTERNAL LDO (VDDA)
VVDDA-REG VDDA regulation voltage 4.75 5 5.25 V VVDDA-UVLO VDDA UVLO rising VVCC rising, VVCCX = 0 V 3.1 3.2 3.3 V VVDDA-HYST VDDA UVLO hysteresis VVCCX = 0 V 120 mV RVDDA VDDA resistance VVCCX = 0 V 5.5 Ω
EXTERNAL BIAS (VCCX)
6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LM25149-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Pin Configuration and Functions 6.1 Wettable Flanks 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings  7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Active EMI Filter 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Input Voltage Range (VIN) 8.3.2 High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA) 8.3.3 Enable (EN) 8.3.4 Power Good Monitor (PG) 8.3.5 Switching Frequency (RT) 8.3.6 Active EMI Filter 8.3.7 Dual Random Spread Spectrum (DRSS) 8.3.8 Soft-Start 8.3.9 Output Voltage Setpoint (FB) 8.3.10 Minimum Controllable On-Time 8.3.11 Error Amplifier and PWM Comparator (FB, EXTCOMP) 8.3.12 Slope Compensation 8.3.13 Inductor Current Sense (ISNS+, VOUT) 8.3.13.1 Shunt Current Sensing 8.3.13.2 Inductor DCR Current Sensing 8.3.14 Hiccup Mode Current Limiting 8.3.15 High-Side and Low-Side Gate Drivers (HO, LO) 8.3.16 Output Configurations (CNFG) 8.3.17 Single-Output Two-phase Operation 8.4 Device Functional Modes 8.4.1 Standby Modes 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC) 8.4.3 Thermal Shutdown 9 Application and Implementation 9.1 Application Information 9.1.1 Power Train Components 9.1.1.1 Buck Inductor 9.1.1.2 Output Capacitors 9.1.1.3 Input Capacitors 9.1.1.4 Power MOSFETs 9.1.1.5 EMI Filter 9.1.2 Error Amplifier and Compensation 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.2.1 Custom Design With WEBENCH® Tools 9.2.2.2 Custom Design With Excel Quickstart Tool 9.2.2.3 Buck Inductor 9.2.2.4 Current-Sense Resistance 9.2.2.5 Output Capacitors 9.2.2.6 Input Capacitors 9.2.2.7 Frequency Set Resistor 9.2.2.8 Feedback Resistors 9.2.2.9 Compensation Components 9.2.2.10 Active EMI Components 9.2.3 Application Curves 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.1.1 Power Stage Layout 11.1.2 Gate-Drive Layout 11.1.3 PWM Controller Layout 11.1.4 Active EMI Layout 11.1.5 Thermal Design and Layout 11.1.6 Ground Plane Design 11.2 Layout Example 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.2 Custom Design With WEBENCH® Tools 12.2 Documentation Support 12.2.1 Related Documentation 12.2.1.1 PCB Layout Resources 12.2.1.2 Thermal Design Resources 12.3 Receiving Notification of Documentation Updates 12.4 Support Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information