Datasheet HMC1086 (Analog Devices) - 3

HMC1086
v06.0318
25 WATT GAN MMIC POWER AMPLIFIER, 2 - 6 GHz Power Added Efficiency vs. Pin Pout vs. Pin
50 50 45 IP 45 40 H 35 ) 40 ) 30 % Bm . ( (d .E 25 T 35 .A U P 20 PO R - C 30 15 E 10 25 5 W 0 20 O 6 9 12 15 18 21 24 27 30 33 6 9 12 15 18 21 24 27 30 33 PIN (dBm) PIN (dBm) 2 GHz 4 GHz 6 GHz 2 GHz 4 GHz 6 GHz R & P A E
Pout vs. Temperature at Pin= 25dBm Pout vs. Vdd at Pin= 25dBm
50 50 IN 45 45 ) S - L Bm Bm (d R (d 40 T T 40 U U PO PO IE 35 35 LIF P 30 30 2 3 4 5 6 2 3 4 5 6 M FREQUENCY (GHz) FREQUENCY (GHz) A +25C +85C -40C Vdd= 24V Vdd= 28V
Psat vs. Temperature Psat vs. Vdd
50 50 45 45 ) Bm Bm (d 40 (d 40 PSAT PSAT 35 35 30 30 2 3 4 5 6 2 3 4 5 6 FREQUENCY (GHz) FREQUENCY (GHz) Vdd= 24V Vdd= 28V +25C +85C -40C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D Document Outline General Description Gain and Return Loss Gain vs. Vdd Input Return Loss Output Return Loss Pout vs. Frequency Power Gain vs. Frequency Power Added Efficiency vs. Pin Pout vs. Pin Pout vs. Temperature at Pin= 25dBm Pout vs. Vdd at Pin= 25dBm Psat vs. Temperature Psat vs. Vdd Drain Current vs. Pin OIP3 vs Pin/Tone IM3 vs. Pin/Tone Reverse Isolation Power Dissipation vs. Pin Second Harmonic vs. Pin Absolute Maximum Ratings[ Outline Drawing Pad Descriptions Application Circuit Assembly Diagram Mounting & Bonding Techniques for GaN MMICs