HMC7229Data Sheet4444–55°C42+25°C42+85°C5.0V40405.5V 6.0V3838Bm)Bm)dd3 (3 (IP36IP36OO3434323230303334353637383940 022 3334353637383940 025 FREQUENCY (GHz)FREQUENCY (GHz) 14566- 14566- Figure 22. Output IP3 vs. Frequency at Various Temperatures Figure 25. Output IP3 vs. Frequency at Various Supply Voltages 4460425550404538Bm) dBc)403 (d800mAIP363 (33GHzO1000mAIM3534GHz1200mA36GHZ3438GHz3039GHz 40GHz322530203334353637383940 023 1012141618202224 026 FREQUENCY (GHz)POUT/TONE (dBm) 14566- 14566- Figure 23. Output IP3 vs. Frequency at Various Supply Current Figure 26. IM3 vs. POUT/Tone for Various Frequencies at VDD = 5.5 V 606055555050454533GHzBc)4034GHzBc)d40d36GHZ3 (38GHz3 (33GHzIM3539GHzIM3534GHz40GHz36GHZ 38GHz303039GHz 40GHz252520201012141618202224 024 1012141618202224 027 POUT/TONE (dBm)P 14566- OUT/TONE (dBm) 14566- Figure 24. Third-Order Intermodulation (IM3) vs. POUT/Tone for Various Figure 27. IM3 vs. POUT/Tone for Various Frequencies at VDD = 5 V Frequencies at VDD = 6 V Rev. D | Page 10 of 16 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 33 GHz to 35 GHz Frequency Range 35 GHz to 37 GHz Frequency Range 37 GHz to 40 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Typical Application Circuit Mounting and Bonding Techniques for Millimeter Wave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Assembly Diagram Outline Dimensions Ordering Guide