35 GHz to 70 GHz, GaAs, pHEMT, MMIC, Medium Power Amplifier
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16 /10 — HMC1144. Data Sheet. 520. POUT. GAIN. PAE. IDD. 470. (%). (% E. , P. ), …
Revisión
D
Formato / tamaño de archivo
PDF / 351 Kb
Idioma del documento
Inglés
HMC1144. Data Sheet. 520. POUT. GAIN. PAE. IDD. 470. (%). (% E. , P. ), P. 420. ) A. , G. I DD. 370. Bm). m B. (d T. OUP. 320. OUP 5. GAIN 320. POUT PAE I. 270. –10
HMC1144Data Sheet2552025520POUTGAINPAE20IDD470)20470(%)(% EAEA, P), PB)1542015420(d) AdB)(NAmINmAI(A(, GI DDG10370),I DD10370Bm)m B(d T(d TOUP5320OUP 5GAIN 320POUT PAE I0270DD 8 0270–10–8–6–4–202468 32 3- –10–8–6–4–20246 203 INPUT POWER (dBm) 1314 INPUT POWER (dBm) 13143- Figure 28. POUT, Gain, PAE, and IDD vs. Input Power at 35 GHz Figure 31. POUT, Gain, PAE, and IDD vs. Input Power at 65 GHz 255201.865GHz55GHz1.745GHz)35GHz20470(% E1.6A ), P1.5dB15420))(AWINm(A(1.4SSGDI),I DDPm103701.3B d ( T1.2OUP 5GAIN 320POUT1.1PAE IDD02701.0 07 2 –10–8–6–4–202468 201 –9–8–7–6–5–4–3–2–10123456–1 -33 INPUT POWER (dBm) 143 13143- INPUT POWER (dBm) 13 Figure 29. POUT, Gain, PAE, and IDD vs. Input Power at 45 GHz Figure 32. Power Dissipation (PDISS) vs. Input Power at 85°C for Various Frequencies 25520109) %204708( E A)7B), P B15420(d)6(dAINmUREA(IG5F), GI DDE4m10370ISdBNO(3T OUP 5GAIN 3202POUT PAE1IDD25°C02700–10–8–6–4–20246 202 505560657075 205 INPUT POWER (dBm)FREQUENCY (GHz) 13143- 13143- Figure 30. POUT, Gain, PAE, and IDD vs. Input Power at 55 GHz Figure 33. Noise Figure vs. Frequency at 25°C Rev. D | Page 10 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 35 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE 50 GHz TO 70 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ALTERNATE BIASING CONFIGURATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE