Datasheet HMC1144 (Analog Devices)

35 GHz to 70 GHz, GaAs, pHEMT, MMIC, Medium Power Amplifier Data Sheet HMC1144 FEATURES FUNCTIONAL BLOCK DIAGRAM Output power for 1 dB compression (P1dB): 21 dBm typical 2 3 4 5 6 Saturated output power (PSAT): 22 dBm typical 1A 1A 2A 3A 4A Gain: 19 dB typical GG DD DD DD DD V V V V V Output third-order intercept (IP3): 28 dBm typical Supply voltage: 4 V at 320 mA 50 Ω matched input/output 7 RFOUT Die size: 2.3 mm × 1.8 mm × 0.05 mm APPLICATIONS HMC1144 Test instrumentation 1 RFIN Microwave radios and very small aperture terminals (VSATs) Military and space Telecommunications infrastructure 1B 1B 2B 3B 4B Fiber optics GG DD DD DD DD V V V V V
001 3-
12 11 10 9 8
1314 Figure 1.
GENERAL DESCRIPTION
The HMC1144 is a gallium arsenide (GaAs), pseudomorphic the HMC1144 provides 19 dB (typical) of gain, 32 dBm output high electron mobility transfer (pHEMT), monolithic microwave IP3, and 21 dBm of output power at 1 dB gain compression. integrated circuit (MMIC), distributed power amplifier that The HMC1144 requires 320 mA from a 4 V supply. The operates from 35 GHz to 70 GHz. In the lower band of 35 GHz to HMC1144 amplifier inputs/outputs are internally matched to 50 GHz, the HMC1144 provides 19 dB (typical) of gain, 28 dBm 50 Ω, facilitating integration into multichip modules (MCMs). output IP3, and 19 dBm and 19.5 dBm, respectively, of output All data is taken with the chip connected via two 0.025 mm (1 mil) P1dB gain compression. In the upper band of 50 GHz to 70 GHz, wire bonds of 0.076 mm (3 mil) minimal length.
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Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 35 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE 50 GHz TO 70 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ALTERNATE BIASING CONFIGURATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE