Datasheet HMC8205BCHIPS (Analog Devices) - 7
| Fabricante | Analog Devices |
| Descripción | 0.4 GHz to 6 GHz, 35 W, GaN, Power Amplifier |
| Páginas / Página | 19 / 7 — Data Sheet. HMC8205BCHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. S11. S21. … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 318 Kb |
| Idioma del documento | Inglés |
Data Sheet. HMC8205BCHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. S11. S21. S22. d (. S 20. URN L. AND RE. N AND RE. AI G. –10. –15. 0.1. 0.2. 0.3. 0.4. 0.5
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Data Sheet HMC8205BCHIPS TYPICAL PERFORMANCE CHARACTERISTICS 35 35 S11 S21 30 S21 30 S11 S22 S22 25 25 B) B) d ( (d S 20 S 20 S S O O 15 15 URN L URN L T 10 10 T 5 5 AND RE N AND RE 0 0 IN AI G –5 GA 5 –10 10 –15 15
12 1
0 1 2 3 4 5 6 7
009
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 FREQUENCY (GHz) FREQUENCY (GHz)
13790- 13790- Figure 9. Gain and Return Loss vs. Frequency Figure 12. Gain and Return Loss vs. Frequency, 10 MHz to 1000 MHz
35 35 30 30 25 25 B) B) d d N ( N ( AI AI G 20 G 20 28V 15 40V 15 45V 50V +85°C 55V +25°C –55°C 10 10 0 1 2 3 4 5 6
010
0 1 2 3 4 5 6
012
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 10. Gain vs. Frequency at Various Supply Voltages Figure 13. Gain vs. Frequency at Various Temperatures
0 35 +85°C –2 +25°C –55°C 30 B) d –4 ( S S O 25 –6 B) d N ( URN L T AI –8 G 20 RE UT –10 INP 15 –12 1300mA 900mA 500mA –14
1
10
1
0 1 2 3 4 5 6
0
0 1 2 3 4 5 6
013
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 11. Input Return Loss vs. Frequency at Varoius Temperatures Figure 14. Gain vs. Frequency at Various Quiescent Supply Currents (IDDx) Rev. A | Page 7 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
12 1
0 1 2 3 4 5 6 7
009
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 FREQUENCY (GHz) FREQUENCY (GHz)
13790- 13790- Figure 9. Gain and Return Loss vs. Frequency Figure 12. Gain and Return Loss vs. Frequency, 10 MHz to 1000 MHz
35 35 30 30 25 25 B) B) d d N ( N ( AI AI G 20 G 20 28V 15 40V 15 45V 50V +85°C 55V +25°C –55°C 10 10 0 1 2 3 4 5 6
010
0 1 2 3 4 5 6
012
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 10. Gain vs. Frequency at Various Supply Voltages Figure 13. Gain vs. Frequency at Various Temperatures
0 35 +85°C –2 +25°C –55°C 30 B) d –4 ( S S O 25 –6 B) d N ( URN L T AI –8 G 20 RE UT –10 INP 15 –12 1300mA 900mA 500mA –14
1
10
1
0 1 2 3 4 5 6
0
0 1 2 3 4 5 6
013
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 11. Input Return Loss vs. Frequency at Varoius Temperatures Figure 14. Gain vs. Frequency at Various Quiescent Supply Currents (IDDx) Rev. A | Page 7 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE