Datasheet HMC8205BCHIPS (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 0.4 GHz to 6 GHz, 35 W, GaN, Power Amplifier |
| Páginas / Página | 19 / 8 — HMC8205BCHIPS. Data Sheet. 28V. +85°C. 40V. +25°C. 45V. –10. –55°C. 50V … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 318 Kb |
| Idioma del documento | Inglés |
HMC8205BCHIPS. Data Sheet. 28V. +85°C. 40V. +25°C. 45V. –10. –55°C. 50V 55V. –20. –30. T A L. –40. URN L. SE I. –50. EVER. INP. –60. –12. –70. –14. –80
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HMC8205BCHIPS Data Sheet 0 0 28V +85°C 40V +25°C –2 45V –10 –55°C 50V 55V ) B) B –20 d –4 ( (d S N S –30 O IO –6 T A L –40 URN L SO T –8 RE SE I –50 UT –10 EVER INP R –60 –12 –70 –14 –80 0 1 2 3 4 5 6
014
0 1 2 3 4 5 6
017
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 15. Input Return Loss vs. Frequency at Various Supply Voltages Figure 18. Reverse Isolation vs. Frequency at Various Temperatures
0 0 1300mA +85°C 900mA +25°C –2 –2 500mA –55°C B) B) d –4 d –4 ( ( S S S S O –6 O –6 URN L –8 URN L T T –8 RE RE –10 UT UT P –10 INP UT –12 O –12 –14 –14 –16 0 1 2 3 4 5 6
015
0 1 2 3 4 5 6
018
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 16. Input Return Loss vs. Frequency at Various Quiescent Supply Figure 19. Output Return Loss vs. Frequency at Various Temperatures Currents (IDDx)
2 0 28V 0 40V –2 45V 50V B) –2 B) d 55V d –4 ( ( S S S –4 S O O –6 –6 URN L URN L –8 T T –8 RE RE –10 UT UT P –10 P UT UT –12 O –12 O 1300mA –14 –14 900mA 500mA –16 –16 0 1 2 3 4 5 6
016
0 1 2 3 4 5 6
019
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 17. Output Return Loss vs. Frequency at Various Supply Voltages Figure 20. Output Return Loss vs. Frequency at Various Quiescent Supply Currents (IDD1 + IDD2) Rev. A | Page 8 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
014
0 1 2 3 4 5 6
017
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 15. Input Return Loss vs. Frequency at Various Supply Voltages Figure 18. Reverse Isolation vs. Frequency at Various Temperatures
0 0 1300mA +85°C 900mA +25°C –2 –2 500mA –55°C B) B) d –4 d –4 ( ( S S S S O –6 O –6 URN L –8 URN L T T –8 RE RE –10 UT UT P –10 INP UT –12 O –12 –14 –14 –16 0 1 2 3 4 5 6
015
0 1 2 3 4 5 6
018
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 16. Input Return Loss vs. Frequency at Various Quiescent Supply Figure 19. Output Return Loss vs. Frequency at Various Temperatures Currents (IDDx)
2 0 28V 0 40V –2 45V 50V B) –2 B) d 55V d –4 ( ( S S S –4 S O O –6 –6 URN L URN L –8 T T –8 RE RE –10 UT UT P –10 P UT UT –12 O –12 O 1300mA –14 –14 900mA 500mA –16 –16 0 1 2 3 4 5 6
016
0 1 2 3 4 5 6
019
FREQUENCY (GHz)
13790-
FREQUENCY (GHz)
13790- Figure 17. Output Return Loss vs. Frequency at Various Supply Voltages Figure 20. Output Return Loss vs. Frequency at Various Quiescent Supply Currents (IDD1 + IDD2) Rev. A | Page 8 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE