Datasheet ADMV7810 (Analog Devices) - 4

ADMV7810 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDD1A to VDD4A, 4.5 V (PCB) design and operating environment. Careful attention to VDD1B to VDD4B) PCB thermal design is required. Gate Bias Voltage (VGG1A to VGG4A, −3 V to 0 V θJC is the junction to case (or die to package) thermal resistance. VGG1B to VGG4B) Maximum Junction Temperature (to Maintain 175°C
Table 3. Thermal Resistance
1 Million Hours Mean Time to Failure
Package Type θ 1 JC Unit
(MTTF)) C-40-3 24.2 °C/W Operating Temperature Range −55°C to +85°C Storage Temperature Range −65°C to 1 Based on the ATROX 800HT1V ® as the die attach epoxy. +150°C Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) 250 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 4 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE