HMC930AData SheetTYPICAL PERFORMANCE CHARACTERISTICS2018+85°C1016+25°C –55°C)0S1114BS21 S22B)SE (ddN–1012N ( AI GESPO R–2010–308–40605101520253035404550 009 048121620242832364044 012 FREQUENCY (GHz) 13738- FREQUENCY (GHz) 13738- Figure 9. Gain and Return Loss Figure 12. Gain vs. Frequency for Various Temperatures 00+85°C+85°C+25°C+25°C–55°C–55°C–10–10B)B)dd((SSSSOO–20–20URN LURN LTTRERE–30–30–40–40048121620242832364044 010 048121620242832364044 013 FREQUENCY (GHz) 13738- FREQUENCY (GHz) 13738- Figure 10. Input Return Loss vs. Frequency for Various Temperatures Figure 13. Output Return Loss vs. Frequency for Various Temperatures 1020108+85°C +25°C –55°C)0)BS11dBS21(6S22ESE (d–10RNFIGU–20EESPO4ROIS N–302–40–50 1 1 00.000010.00010.0010.010.1110 0 0481216202428323640 014 FREQUENCY (GHz) 13738- FREQUENCY (GHz) 13738- Figure 11. Low Frequency Gain and Return Loss Figure 14. Noise Figure vs. Frequency for Various Temperatures Rev. A | Page 8 of 16 Document Outline Features Applications Functional Block Diagram General Description Revision History Electrical Specifications DC to 12 GHz Frequency Range 12 GHz to 32 GHz Frequency Range 32 GHz to 40 GHz Frequency Range Total Supply Current by VDD Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Wire Bonding Outline Dimensions Die Packaging Information Ordering Guide