Datasheet HMC930A (Analog Devices) - 2

FabricanteAnalog Devices
DescripciónGaAs, pHEMT, MMIC, 0.25 W Power Amplifier, DC to 40 GHz
Páginas / Página16 / 2 — HMC930A. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 3/2020—Rev. 0 to …
Formato / tamaño de archivoPDF / 270 Kb
Idioma del documentoInglés

HMC930A. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 3/2020—Rev. 0 to Rev. A. 12/2015—Revision 0: Initial Version

HMC930A Data Sheet TABLE OF CONTENTS REVISION HISTORY 3/2020—Rev 0 to Rev A 12/2015—Revision 0: Initial Version

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HMC930A Data Sheet TABLE OF CONTENTS
Features .. 1 Pin Configuration and Function Descriptions ...6 Applications .. 1 Interface Schematics ...7 Functional Block Diagram .. 1 Typical Performance Characteristics ...8 General Description ... 1 Theory of Operation .. 13 Revision History ... 2 Applications Information ... 14 Electrical Specifications ... 3 Biasing Procedures ... 14 DC to 12 GHz Frequency Range .. 3 Mounting and Bonding Techniques for Mil imeterwave 12 GHz to 32 GHz Frequency Range .. 3 GaAs MMICs .. 15 32 GHz to 40 GHz Frequency Range .. 4 Outline Dimensions ... 16 Total Supply Current by V Die Packaging Information .. 16 DD .. 4 Absolute Maximum Ratings ... 5 Ordering Guide .. 16 ESD Caution.. 5
REVISION HISTORY 3/2020—Rev. 0 to Rev. A 12/2015—Revision 0: Initial Version
Changes to Channel Temperature Parameter and Continuous Power Dissipation, PDISS (TA = 85°C, Derate 32.1 mW/°C Above 85°C) Parameter, Table 5 .. 5 Rev. A | Page 2 of 16 Document Outline Features Applications Functional Block Diagram General Description Revision History Electrical Specifications DC to 12 GHz Frequency Range 12 GHz to 32 GHz Frequency Range 32 GHz to 40 GHz Frequency Range Total Supply Current by VDD Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Wire Bonding Outline Dimensions Die Packaging Information Ordering Guide