Datasheet HMC460LC5 (Analog Devices) - 7

HMC460LC5
v08.1217
GaAs pHEMT MMIC LOW NOISE AMPLIFIER, DC - 20 GHz Evaluation PCB
T M E - S IS O W N O S - L R IE LIF P M A
List of Materials for Evaluation PCB 117810 [1]
The circuit board used in the application should use Item Description RF circuit design techniques. Signal lines should have J1 - J2 PCB Mount SMA Connector 50 Ohm impedance while the package ground leads J3 - J4 2 mm Molex Header and package bottom should be connected directly to C4 100 pF Capacitor, 0402 Pkg. the ground plane similar to that shown. A sufficient C2, C3 1000 pF Capacitor, 0402 Pkg. number of via holes should be used to connect the C1 4.7 µF Capacitor, Tantalum top and bottom ground planes. The evaluation board C5 0.1 uF Capacitor, 0603 Pkg. should be mounted to an appropriate heat sink. The C6 0.01 uF Capacitor, 0603 Pkg. evaluation circuit board shown is available from C7 2.2 uF Capacitor, 0603 Pkg. Analog Devices upon request. U1 HMC460LC5 PCB [2] 117808 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Broadband Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Temperature P1dB vs. Temperature Psat vs. Temperature Output IP3 vs. Temperature Gain, Power & Noise Figure vs. Supply Voltage @ 10 GHz, Fixed Vgg Reverse Isolation vs. Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing