Datasheet HMC902 (Analog Devices) - 6
| Fabricante | Analog Devices |
| Descripción | 5 GHz to 11 GHz GaAs, pHEMT, MMIC, Low Noise Amplifier |
| Páginas / Página | 13 / 6 — HMC902. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C. … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 274 Kb |
| Idioma del documento | Inglés |
HMC902. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C. –55°C. SS (dB) O. TURN L. dB) N (. N AND RE. AI G. –15. ADBAND G. S11. BRO
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HMC902 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 25 25 +85°C +25°C –55°C SS (dB) O 15 23 TURN L 5 21 dB) N ( N AND RE AI G AI –5 19 –15 17 ADBAND G S11 BRO S21 S22 –25 15 3 5 7 9 11 13
008
4 5 6 7 8 9 10 11
110
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 8. Broadband Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C +25°C +25°C –55°C –5 –40°C –5 –10 –10 SS (dB) SS (dB) O O –15 –15 TURN L TURN L RE RE UT –20 PUT –20 INP UT O –25 –25 –30 –30 4 5 6 7 8 9 10 11
009
5 6 7 8 9 10 11
012
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
6 35 +85°C +25°C –55°C 5 30 ) 4 25 E (dB R dBm) 3 IP3 ( 20 E FIGU PUT OIS N 2 UT O 15 1 10 +85°C +25°C –40°C 0 4 5 6 7 8 9 10 11
010
5 5 6 7 8 9 10
013
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Output IP3 vs. Frequency at Various Temperatures Rev. D | Page 6 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE
008
4 5 6 7 8 9 10 11
110
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 8. Broadband Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C +25°C +25°C –55°C –5 –40°C –5 –10 –10 SS (dB) SS (dB) O O –15 –15 TURN L TURN L RE RE UT –20 PUT –20 INP UT O –25 –25 –30 –30 4 5 6 7 8 9 10 11
009
5 6 7 8 9 10 11
012
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
6 35 +85°C +25°C –55°C 5 30 ) 4 25 E (dB R dBm) 3 IP3 ( 20 E FIGU PUT OIS N 2 UT O 15 1 10 +85°C +25°C –40°C 0 4 5 6 7 8 9 10 11
010
5 5 6 7 8 9 10
013
FREQUENCY (GHz)
14525-
FREQUENCY (GHz)
14525- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Output IP3 vs. Frequency at Various Temperatures Rev. D | Page 6 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE